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Koh Young Expands Manufacturing Operations for Increased Capacity and Faster Delivery
March 15, 2023 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology, the industry leader in the True 3D measurement-based inspection solutions, is proudly announcing the grand opening of our new Yeoju production center in South Korea. “Last year marked our 20-year anniversary. During the past two decades, we have solidified our position as the manufacturing standard for SPI (solder paste inspection) and AOI (automated optical inspection) equipment across the electronics manufacturing industry,” said JD Shin, Chief Sales Officer at Koh Young. “With so many companies relying on us for their inspection needs, we needed to increase our production capacity to maintain customer satisfaction.”
Moving the production site has allowed for an expansive production space, which increases our production capacity by over 150 percent. The newly constructed facility is nearly twice the size of the previous factory and allows Koh Young to produce more than 6,000 machines per year before making any further process improvements.
With the growing customer demand for our products, this new capacity will ensure efficient manufacturing and faster order fulfillment. Aside from our industrial inspection division, which delivers products for electronics assembly, the new facility has dedicated space for our growing medical robotics division. Capable of producing over 260 medical systems annually, Koh Young can contribute to the revolution in medical technology for the benefit of mankind and society.
Additional content from Koh Young:
- “Smarter Manufacturing Enabled with Smart Data” by Ivan Aduna, a free 12-part micro webinar series
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007eBooks library.
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Klaus Koziol - atgSuggested Items
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10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
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Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.