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MKS’ Atotech to Participate in CPCA Show
March 20, 2023 | AtotechEstimated reading time: 1 minute

MKS Instruments announced its participation in the upcoming CPCA Show 2023, the international electronic circuits exhibition in Shanghai, China held from March 22-24, 2023. MKS will be present with representatives from two of its strategic brands, Atotech and ESI, and present its latest products and manufacturing solution for printed circuit board and package substrate manufacturing.
Product experts from overseas will be joining the local team and be available to discuss the latest industry trends and challenges, as well as introduce the new combined product offering consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service. The company will be exhibiting at booth 7T26 and this year’s product highlights include:
- V-Plate: The new gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
- InPro SAP6: The new high-end electrolyte for vertical processing of next-generation package substrates
- New Uniplate: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrates manufacturing
- Printoganth MV TP2: Next-generation electroless copper for fine-line SAP applications
- BondFilm EX: New bonding enhancement solution for low signal loss high-frequency applications
- PallaBond: Direct pure EPAG for high-end circuitry and reliability application
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- GeodeTM: HDI PCB and package substrate high-precision CO2 via drilling tool
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07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.