MobileDrive Builds Next Generation Autonomous Driving Systems with Siemens’ Digital Twin TechnologyMarch 21, 2023 | Siemens
Estimated reading time: 2 minutes
Siemens Digital Industries Software announced that MobileDrive has adopted a model-based systems engineering (MBSE) approach to support its Advanced Driver Assistance Systems (ADAS) development, using the Siemens Xcelerator portfolio and its comprehensive digital twin technology. By leveraging Siemens’ robust expertise in the digital thread, MobileDrive has accelerated its progress to build the next-generation autonomous driving systems and helped to achieve the industry-leading quality of the products.
Founded in 2021 as a joint venture between two mobility technology leaders, FIH Mobile and Stellantis, MobileDrive is focused on developing infotainment, telematics and a cloud service platform, together with ancillary hardware and software. Combining exceptional innovation capabilities with over 15 years software/hardware integration experience, MobileDrive is the first company in Taiwan capable of providing complete in-vehicle solutions with cutting-edge AI technology.
Aiming to deliver the highest quality software to meet market demands in a time-to-market manner, MobileDrive’s primary interest was to use a model-based framework to develop the algorithms and software controls for common and advanced ADAS applications, such as Lane Keep Assist (LKA), Emergency Lane Keeping (ELK), Lane Following Control (LFC), Auto Lane Change (ALC), Emergency Steering Assist (ESA), and Autonomous Emergency Steering (AES).
To help the organization achieve its goals, Siemens’ Simcenter™ Engineering and Consulting services team worked with MobileDrive to deliver a complete methodology and roadmap for its ADAS vision while developing the control algorithms and building a detailed scenario-based system model including sensors and vehicle dynamics, based on market led full vehicle requirements using the Siemens Xcelerator portfolio of software and services.
This systems model was then applied to virtual test environment allowing the MobileDrive team to observe vehicles as a true digital twin to quickly uncover and address both system and software performance issues earlier in the development cycle.
Ultimately, MobileDrive realized a more effective and reliable software development process before a physical prototype was even built. This was due to their newfound ability to verify ADAS software features early in the digital twin environment, reducing the effort of hardware-in-the-loop (HiL) and vehicle testing.
“The automotive industry is undergoing major transformations to better satisfy the needs of users in diverse scenarios and enable a more intuitive, seamless in-vehicle user experience and we have established the key sophisticated technologies and actively collaborated with reliable partners,” said Winston Hsu, CTO at MobileDrive. “Thanks to our collaboration with Siemens, we are able to bring our products to market in a much more streamlined, efficient manner.”
MobileDrive has successfully delivered products combining security, personalization, and reliability to automakers and has also been awarded ISO 26262 for automotive functional safety, helping toimprove the driving safety of vehicles.
I just finished counting the percentage of times in which artificial intelligence/machine learning/data analytics topics appeared in the I-Connect007 news this week. What do you think the percentage is? AI has moved well beyond a technical term; heck, it has clearly also eclipsed catch-phrase status. It seems a foregone conclusion that AI applications will be inserting themselves into manufacturing just as they are appearing in our handheld devices. Speaking of handhelds, that market seems to be growing as well. This week’s five must-reads include smartphone market data, telecom infrastructure development, a new white paper on the influence of data analytics, a report on the European market, and the launch of a new podcast series on PCB 3.0, a new design methodology.
The keynote session for the EIPC 2024 Winter Conference addressed several topics, ranging from applications for superconductivity to the fluctuating European financial market and the importance of IC substrates. The conference took place in late January at the IHK Academie in the city of Villingen-Schwenningen, on the eastern edge of the Black Forest in southwest Germany.
New Horizon Aircraft Ltd., doing business as Horizon Aircraft (“Horizon Aircraft” or the “Company”), a leading hybrid electric Vertical TakeOff and Landing (“eVTOL”) aircraft developer, publishes new global research* that indicates global investors are anticipating the first commercial passenger routes of electric Vertical Takeoff and Landing (eVTOL) aircraft to be operational in the next few years as the Future Air Mobility market continues to advance rapidly.
Tower Semiconductor and Tianyi Micro Announce Strategic Cooperation in Development of Next Generation OLED Micro Displays for AR/VR02/27/2024 | Tower Semiconductor
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