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BTU Showcases the Ultimate Flux Management Solution at the SMTA Texas Expos
March 22, 2023 | BTU International, Inc.Estimated reading time: 1 minute

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the following upcoming events where they will discuss Aqua Scrub™ flux management technology and PYRAMAX™ reflow ovens.
- SMTA Dallas Expo & Tech Forum on Tuesday, March 28, 2023, at the Plano Event Center in Plano, TX
- SMTA Houston Expo & Tech Expo on Thursday, March, 30, 2023, at the Stafford Centre in Stafford, TX.
The Aqua Scrub flux management system is purpose-built as a stand-alone system that can be easily retrofitted on PYRAMAX reflow ovens in the field as well as optional on new PYRAMAX ovens from the factory. The next-generation solder reflow flux management system is designed to decrease operational cost by 4X compared to traditional condensation systems. Aqua Scrub’s patent-pending design uses an aqueous-based gas scrubbing technology compatible with most known paste and flux types.
“Our Aqua Scrub flux management system has been widely adopted in many high-volume production lines in the Southwest region,” said Isaiah Smith, regional sales manager for BTU. “Aqua Scrub is a truly novel system allowing efficient flux collection regardless of chemistry, and our system has been further optimized with a new more efficient rinse agent, and improved gas extraction,” added Smith.
BTU PYRAMAX reflow ovens provide optimized lead-free processing for the ultimate productivity and efficiency. BTU’s exclusive closed-loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry. With 6, 8, 10, and 12-zone air or nitrogen models, 350°C maximum temperature, and a comprehensive menu of options, Pyramax™ reflow ovens are the industry’s most versatile performers and best value.
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Julia McCaffrey - NCAB GroupSuggested Items
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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.