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Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
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iNEMI Packaging Tech Topic Series Evolution of Power Packaging
March 23, 2023 | iNEMIEstimated reading time: Less than a minute
Make plans to join us for iNEMI’s March Packaging Tech Topic webinar. Power electronics have become increasingly important in modern electronic systems. Andy Mackie, PhD, of Indium Corporation will be talking about the evolution of power electronics packaging, focusing in particular on advancements in assembly and thermal interface materials.
The webinar will cover:
- Challenges associated with power electronics packaging and the critical role that assembly and thermal interface materials play in addressing these challenges
- Impact of emerging technologies such as silicon carbide (SiC) and gallium nitride (GaN) on power electronics packaging and the new challenges they pose
- An in-depth analysis of the different types of materials used in power electronics packaging, their advantages, and limitations
- The future direction of power electronics packaging and the potential for further advancements in assembly and thermal interface materials to enable even more efficient and reliable power electronic systems
Evolution of Power Packaging: Assembly and Thermal Interface Materials
Presented by Andy Mackie, PhD, Indium Corporation
Tuesday, March 28, 2023
9:00-10:00 a.m. EDT (US)
3:00-4:00 p.m. CEST (Europe)
22:00-23:00 p.m. JST (Japan)
For more information visit iNEMI's website.
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Battling Counterfeit Electronics in Manufacturing
10/07/2024 | Nolan Johnson, I-Connect007Paul Jarski, product development manufacturing leader at Case New Holland (CNH), discusses his extensive experience with counterfeit electronics throughout his career. He highlights the challenges faced during market allocations, where counterfeit parts infiltrated supply chains and causing significant issues. Paul recounts the rigorous processes implemented to detect and prevent counterfeits, including advanced material analysis and testing. Counterfeit parts occasionally slipped through despite these measures, leading to costly and time-consuming audits and verifications to ensure product integrity and safety.