-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
iNEMI Packaging Tech Topic Series Evolution of Power Packaging
March 23, 2023 | iNEMIEstimated reading time: Less than a minute

Make plans to join us for iNEMI’s March Packaging Tech Topic webinar. Power electronics have become increasingly important in modern electronic systems. Andy Mackie, PhD, of Indium Corporation will be talking about the evolution of power electronics packaging, focusing in particular on advancements in assembly and thermal interface materials.
The webinar will cover:
- Challenges associated with power electronics packaging and the critical role that assembly and thermal interface materials play in addressing these challenges
- Impact of emerging technologies such as silicon carbide (SiC) and gallium nitride (GaN) on power electronics packaging and the new challenges they pose
- An in-depth analysis of the different types of materials used in power electronics packaging, their advantages, and limitations
- The future direction of power electronics packaging and the potential for further advancements in assembly and thermal interface materials to enable even more efficient and reliable power electronic systems
Evolution of Power Packaging: Assembly and Thermal Interface Materials
Presented by Andy Mackie, PhD, Indium Corporation
Tuesday, March 28, 2023
9:00-10:00 a.m. EDT (US)
3:00-4:00 p.m. CEST (Europe)
22:00-23:00 p.m. JST (Japan)
For more information visit iNEMI's website.
Suggested Items
Wolfspeed Stock Soars After Filing for Chapter 11 Bankruptcy
07/01/2025 | I-Connect007 Editorial TeamOn July 1, Wolfspeed shares doubled following the company’s announcement on June 30 that it had filed for Chapter 11 bankruptcy protection.
Zollner Completes Full Acquisition of Bluechips Microhouse
07/01/2025 | Zollner Elektronik AGZollner Elektronik AG has successfully finalized its com- plete takeover of Bluechips Microhouse Co., Ltd., in Thailand. In the future the company will operate as part of the Zollner Group of companies under the leadership of Thomas Kiefl – strategically networked, technologically focused and internationally oriented.
Inission Acquires the Lithuanian Company Selteka
07/01/2025 | InissionInission AB has signed an agreement to acquire 100% of UAB Selteka. Selteka is a well-respected EMS (electronics manufacturing services) company with operations located in Kaunas, Lithuania.
RTX, Shield AI Partner to Develop New Defense Capabilities
07/01/2025 | RTXRTX and Shield AI announced a new partnership to integrate Shield AI capabilities into select RTX defense products, like loitering munitions and sensors. This collaboration will deliver enhanced, autonomous capabilities to US and allied defense forces.
Lockheed Martin Completes Acquisition of Amentum’s Rapid Solutions Portfolio
07/01/2025 | Lockheed MartinLockheed Martin has closed its acquisition of the Rapid Solutions business of Amentum, an engineering and technology solutions company.