-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Applauds New U.S.-Canada Partnership to Strengthen Advanced Packaging, PCB Manufacturing in North America
March 27, 2023 | IPCEstimated reading time: 2 minutes
The following is statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint statement today of U.S. President Joe Biden and Canadian Prime Minister Justin Trudeau:
“On behalf of electronics manufacturers, IPC applauds the just-announced partnership between the United States and Canada ‘to strengthen advanced packaging for semiconductors and printed circuit boards in North America,’ including an additional USD $50 million in U.S. Defense Production Act funding for those purposes.
“In order to achieve their shared goals, the U.S. and Canada must invest in and support the growth of the electronics manufacturing ecosystem, including printed circuit boards (PCBs), IC substrates, and semiconductor assembly. Neglecting a “silicon-to-systems” approach would undercut the promise of the CHIPS Act and the region’s long-term leadership in innovation.
“Today’s announcement represents another meaningful step toward rebuilding a North American electronics manufacturing industry that was once the envy of the world.”
This is the third time in a month that the U.S. Government has called for a “more than just chips” approach to implementing the CHIPS Act. On Feb. 23, Commerce Secretary Gina Raimondo said the government is working to establish at least two new, large-scale clusters of leading-edge semiconductor fabs, each with a robust supplier ecosystem, cutting-edge R&D, and workforce training. Significantly, she said the U.S. will develop multiple high-volume “advanced packaging” facilities and become a global leader in chip packaging technologies.
The week before, on a Freakonomics podcast, Raimondo confirmed that some CHIPS Act funding will go to “smaller firms,” including “circuit-board companies.”
Here are additional IPC resources on this issue:
- Website and video with industry leader soundbites: IPC has just published a new website with background information on advanced packaging. At the top of this page is a new video with straight-to-the-camera soundbites from nine electronics industry leaders on the need to strengthen the entire electronics manufacturing ecosystem.
- Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT) recently called on the U.S. Department of Defense (DoD) to use the Defense Production Act (DPA) to increase domestic production of printed circuit boards (PCBs) and integrated circuit (IC) substrates. With over 50% of PCBs being imported from China, they said it is critical that the DoD increase domestic production and ensure the use of electronics from trusted sources. Read the full letter here.
Suggested Items
Cicor Group Continues to Thrive in a Challenging Market
10/15/2024 | CicorRevenue increased by 26.3% to CHF 120.4 million, bringing the year-to-date total to CHF 351.7 million. The company's strong order intake, with a book-to-bill ratio of 1.01, indicates a healthy pipeline of future business.
The Government Circuit: Support for Defense Spending Takes Top Priority
10/15/2024 | Chris Mitchell -- Column: The Government CircuitFor those of us living in the world of politics and policy, the final few weeks before a major election are a little nerve-wracking. Who is going to win? How might the candidates’ campaign promises affect our industry and our strategies over the next few years? One thing I do know: No matter who wins the White House and control of Congress on Nov. 5, IPC will continue working with members of both major parties to advance policies that boost innovation, investment, and growth and ensure the electronics manufacturing industry’s long-term success. We must.
Spirit Electronics Offers TE Connectivity’s Sensor Products in Franchised Distribution Agreement
10/15/2024 | BUSINESS WIRESpirit Electronics announces franchised distribution for TE Connectivity’s sensor product lines. TE Sensors are engineered for performance and reliability, offering flexible and durable solutions for Spirit’s aerospace and defense customers.
Fall 2024 Issue of IPC Community Now Available
10/14/2024 | IPC Community Editorial TeamThere’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way. Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/11/2024 | Andy Shaughnessy, Design007 MagazineThis week’s roundup is a duke’s mixture of news items and interviews with industry experts from design, fabrication and assembly. There’s a lot going on in electronics now. We’ll be bringing you full coverage of SMTA International the week of Oct. 20-24, so stay tuned.