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‘Deepfake’ ComponentsHentec/RPS Publishes Achieving Greater Through-Hole Soldering Reliability Tech Paper
March 28, 2023 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the suggestion that electronic manufacturers should implement automated selective soldering as opposed to using manual soldering. This technical paper encompasses critically important information and is entitled “Achieving Greater Through-Hole Soldering Reliability Without Sacrificing Throughput.”
Topics covered within this publication include soldering methods, manual soldering, hand soldering reliability, process considerations, versatility vs. throughput, fluxing control, process repeatability, and selective soldering system flexibility.
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