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iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/24/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small.

Dymax Expands Core Market Focus to Include the Energy Sector

07/24/2024 | Dymax
Dymax, a leading manufacturer of rapid curing materials and equipment, announces a curated lineup of light-curable adhesives and coatings designed to meet the complex assembly needs of stationary energy storage systems such as industrial gas turbines (IGTs) and various types of fuel cells and electrolyzers including Solid Oxide (SOFC) and Proton Exchange Membrane (PEMFC).

Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization

07/16/2024 | Michael Carano -- Column: Trouble in Your Tank
Laminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.

Halo Industries Closes $80 Million Series B Funding Round Led by Thomas Tull’s U.S. Innovative Technology Fund

07/16/2024 | BUSINESS WIRE
Halo Industries, Inc., the creator of a laser manufacturing technology platform for the semiconductor industry, announced it raised up to $80 million in its oversubscribed Series B funding round. Led by Thomas Tull’s U.S. Innovative Technology Fund (USIT) with participation from 8VC and SAIC, the funding will help Halo Industries scale the commercialization and reach of its technology and advance its mission to establish the new gold-standard of silicon carbide substrate production.

iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/16/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small. To enable larger chips, manufacturers are migrating to system-on-a-package (SOP).
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