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What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Seika’s New Next-Generation Fully Automatic Nozzle Cleaner Offers Cleaning, Inspection & Traceability
March 31, 2023 | Seika Machinery, Inc.Estimated reading time: Less than a minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to introduce the new Sawa SCI-EZY next generation fully automatic nozzle cleaner. The system provides cleaning, inspection and traceability all in one unit.
Track and trace the nozzle status for each cleaning by reading the 2D code on the nozzle. Cleaning with Ultrasonic + Vacuuming significantly decreases cleaning time (more than 150 minutes). Cleaning history, inspection result and inspection image are linked to the nozzle ID and stored in the management PC.
YAMAH nozzle holders can be set directly on the Sawa SCI-EZY for fully automatic cleaning. Additionally, the system’s inspection capabilities include air pressure inspection, optional sliding inspecting and optional camera inspection.
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PCB Cleaning Machines Market Driven by Innovation to Achieve USD 2.6 Billion Milestone by 2034
12/16/2024 | GlobeNewswireThe PCB Cleaning Machines Market is driven by the need for efficient removal of harmful residues from printed circuit boards, ensuring reliability and performance of electronic devices.
IPC Webinar: Optimizing Cleaning Products Used in Electronics Manufacturing
12/02/2024 | IPCThe electronics industry is committed to improving manufacturing practices and one way to do this is using safer and more sustainable cleaning products across the electronics manufacturing life cycle.
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
12/02/2024 | ZESTRONZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”
The Knowledge Base: The Impact of Harsh Environments on Residue Tolerance
11/26/2024 | Mike Konrad -- Column: The Knowledge BaseElectronic devices are ubiquitous, performing critical functions in a wide range of applications, from consumer electronics to aerospace, medical devices, automotive systems, and industrial control systems. Many of these devices operate in harsh environments characterized by extremes in temperature, humidity, pollution, and chemical exposure.