Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
YINCAE Launches Breakthrough Thermal Underfill: UF 158A2
April 5, 2023 | YINCAEEstimated reading time: 1 minute
YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product: Thermal Underfill - UF 158A2.
Designed for use in a variety of electronic devices, not only can UF 158A2 replace underfill, silver epoxy paste and thermal pad/paste in one step in CoWoS package, but also provides superior protection and improved thermal management for critical components. By filling the space between the device and the PCB (Printed Circuit Board), Thermal Underfill enhances the structural integrity of the assembly while reducing stress on solder joints.
UF 158A2 is ideal for use in high-reliability applications where temperature cycling, shock, and vibration can cause damage to electronic components. The product features excellent thermal conductivity and high-temperature stability, ensuring optimal performance even in the most demanding environments.
"We are excited to introduce UF 158A2 to our product portfolio," said Dr. Wusheng Yin, CEO of YINCAE. "Our team of engineers and scientists have worked tirelessly to develop a product that meets the growing demands of the electronics industry. We believe that UF 158A2 will provide our customers with a reliable and cost-effective solution: 1). Fast flow and easy to underfill 100x100 mm chip (20m gap); 2) Shorten Manufacturing Process; 3). High thermal conductivity 3-4W/mk; 4). Snap cure and reworkable; 5). Huge cost saving, for their thermal management needs."
UF 158A2 is available in a variety of formulations to suit different application requirements. The product is easy to apply and can be cured at low temperatures, making it suitable for use with a range of electronic devices. With its exceptional performance, reliability, and ease of use, UF 158A2 is set to become a key player in the electronics industry.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.