-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Majority Sale of Schweizer China Confirmed by WUS Shareholders
April 18, 2023 | Schweizer Electronic AGEstimated reading time: 2 minutes

The shareholders' meeting of WUS Printed Circuits (Kunshan) Co, Ltd (WUS) approved the acquisition of a majority stake in Schweizer Electronic (Jiangsu) Co, Ltd (SEC). As a result, WUS's shareholding in SEC will increase from the current level of approximately 13% to 70%. The transfer of the shares and payment of the purchase price is expected to take place before end of April 2023.
Parallelly, WUS will carry out a capital increase of around EUR 29 million at the joint venture in China, in which Schweizer Electronic AG will not participate. Finally, SCHWEIZER will thus hold around 20% of the joint venture in China. This capital increase is also expected to take place in April.
The conclusion of this transaction for the joint venture in China is also the starting signal for further intensification of the long and successful cooperation with WUS. Already now, SCHWEIZER generates almost 30% of its consolidated sales through cooperation in the field of high-frequency PCBs.
Both companies have agreed to significantly expand this cooperation model. SCHWEIZER will thus significantly widen its range of competitive and high-technology PCBs globally. The core of the strategy remains the plant in Schramberg, Germany, with a central role not only by its technological excellence but also by improving supply chain resilience for European and American customers, as well as the joint venture in China, with focus on ensuring high production volumes of chip embedding technology. The joint venture will continue to operate under the name Schweizer Electronic, to represent European technology competence - produced in China. Under the new majority structure Schweizer Electronic AG will still retain a seat on the Board of Directors of SEC and will thus be able to actively influence the business processes in the joint venture.
In addition to the plant in Germany and the joint venture in China, SCHWEIZER will also have full access to the technologies of the other WUS plants. SCHWEIZER is thus expanding its offer based on a unique network in Germany, Taiwan, China and, in future, also Thailand.
This enables SCHWEIZER to address additional product and market segments and increases the opportunity for additional growth without the need for own high investments in production capacities. SCHWEIZER will develop from a manufacturer of highly specialised PCB technologies for niche segments to a system provider of a broad technology portfolio from Germany, China and Southeast Asia, and offer customers increasingly important additional services such as supply chain resilience, local value creation, global sales organisation, protection of sensitive intellectual property and the technological consulting expertise of a PCB manufacturer, which has convinced its customers over decades with competence and reliability.
Suggested Items
Intel Appoints Lip-Bu Tan as Chief Executive Officer
03/13/2025 | Intel CorporationIntel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
03/13/2025 | TSMCMediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
Hon Hai Research Institute Launches Traditional Chinese LLM With Reasoning Capabilities
03/13/2025 | PRNewswireHon Hai Research Institute announced today the launch of the first Traditional Chinese Large Language Model (LLM), setting another milestone in the development of Taiwan's AI technology with a more efficient and lower-cost model training method completed in just four weeks.
indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
03/12/2025 | GlobalFoundriesindie Semiconductor, an automotive solutions innovator, has announced a strategic collaboration with GlobalFoundries (Nasdaq: GFS) (GF) to develop its portfolio of high-performance radar systems-on-chip (SoC).
atg Luther Maelzer to Showcase Latest Generation Large Format Flying Probe Test Systems at IPC APEX EXPO 2025
03/11/2025 | atg Luther & Maelzeratg Luther Maelzer will showcase their latest technology, the A9L, at the upcoming IPC APEX EXPO. The A9L will be on display from March 18 – 20 at the Anaheim Convention Center in Booth 3934.