-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Majority Sale of Schweizer China Confirmed by WUS Shareholders
April 18, 2023 | Schweizer Electronic AGEstimated reading time: 2 minutes
The shareholders' meeting of WUS Printed Circuits (Kunshan) Co, Ltd (WUS) approved the acquisition of a majority stake in Schweizer Electronic (Jiangsu) Co, Ltd (SEC). As a result, WUS's shareholding in SEC will increase from the current level of approximately 13% to 70%. The transfer of the shares and payment of the purchase price is expected to take place before end of April 2023.
Parallelly, WUS will carry out a capital increase of around EUR 29 million at the joint venture in China, in which Schweizer Electronic AG will not participate. Finally, SCHWEIZER will thus hold around 20% of the joint venture in China. This capital increase is also expected to take place in April.
The conclusion of this transaction for the joint venture in China is also the starting signal for further intensification of the long and successful cooperation with WUS. Already now, SCHWEIZER generates almost 30% of its consolidated sales through cooperation in the field of high-frequency PCBs.
Both companies have agreed to significantly expand this cooperation model. SCHWEIZER will thus significantly widen its range of competitive and high-technology PCBs globally. The core of the strategy remains the plant in Schramberg, Germany, with a central role not only by its technological excellence but also by improving supply chain resilience for European and American customers, as well as the joint venture in China, with focus on ensuring high production volumes of chip embedding technology. The joint venture will continue to operate under the name Schweizer Electronic, to represent European technology competence - produced in China. Under the new majority structure Schweizer Electronic AG will still retain a seat on the Board of Directors of SEC and will thus be able to actively influence the business processes in the joint venture.
In addition to the plant in Germany and the joint venture in China, SCHWEIZER will also have full access to the technologies of the other WUS plants. SCHWEIZER is thus expanding its offer based on a unique network in Germany, Taiwan, China and, in future, also Thailand.
This enables SCHWEIZER to address additional product and market segments and increases the opportunity for additional growth without the need for own high investments in production capacities. SCHWEIZER will develop from a manufacturer of highly specialised PCB technologies for niche segments to a system provider of a broad technology portfolio from Germany, China and Southeast Asia, and offer customers increasingly important additional services such as supply chain resilience, local value creation, global sales organisation, protection of sensitive intellectual property and the technological consulting expertise of a PCB manufacturer, which has convinced its customers over decades with competence and reliability.
Suggested Items
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.