-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SHENMAO Offers UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV
April 18, 2023 | SHENMAO America, Inc.Estimated reading time: 1 minute

SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.
The SHENMAO PF629-P214UV solder paste is a lead-free, no-clean formula that is ideal for use in a wide range of applications, from consumer electronics to automotive and aerospace components. Its unique UV-visible feature allows easy and accurate quality control inspection during production and ensures the product is used correctly and reliably.
Flux residue of PF629-P214UV after reflow process can be easily identified by UV light due to its special flux design.
The PF629-P214UV solder paste offers superior performance in terms of solderability, wettability, and printability, providing a strong bond between the components and the PCB. It has excellent wetting ability and can form strong, smooth, and shiny solder joints, making it an ideal choice for high-reliability applications.
SHENMAO Technology has a reputation for producing high-quality solder materials, and the PF629-P214UV solder paste is no exception. The company is committed to providing its customers with the latest and most advanced products and services, and the new solder paste is just one example of this commitment.
Suggested Items
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
KYZEN to Feature Stencil Cleaning and Aqueous Cleaners at SMTA Capital Expo and Tech Form
04/28/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Capital Expo and Tech Forum, scheduled to take place Thursday, May 8 at George Mason University – Mason Square in Arlington, VA.
KYZEN Focuses on Aqueous Cleaning and Stencil Cleaning at SMTA Wisconsin
04/24/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Wisconsin Expo and Tech Forum, scheduled to take place Tuesday, May 6 at the Crowne Plaza Milwaukee Airport. KYZEN will be on-site to provide attendees with information about aqueous cleaning chemistry AQUANOX A4618 and stencil cleaner KYZEN E5631J.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.