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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/20/2026 | Marcy LaRont, I-Connect007
It’s been a busy week for many of us traversing the conference halls and exhibition floor at APEX EXPO in Anaheim, California. This is the 26th event since it was renamed APEX EXPO in 2000. For those who love trivia, and in reverence to the founders, a more accurate accounting is that 2026 marks its 33rd year, beginning in 1994 as the IPC Printed Circuits Expo. It’s always a great time to convene with old friends, colleagues, and customers, as well as to meet exciting new companies and individuals with interesting things to share. And afterwards, it’s always nice to get home.

The Chemical Connection: Some Amusing Stories from APEX EXPO

02/24/2026 | Don Ball -- Column: The Chemical Connection
Once again, it’s time for APEX EXPO, a chance to see what’s new in the industry, meet and speak with old friends and colleagues you haven’t seen in a while, and have face-to-face meetings with your suppliers. This last point is especially important for capital equipment suppliers like us, where months or even years might go by without physical contact. So often, contact is just phone calls and emails, and sometimes not even those.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

02/13/2026 | Michelle Te, I-Connect007
This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.

I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec

02/12/2026 | I-Connect007 Editorial Team
I-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.

Design007’s Top 10 Reader’s Picks for 2025

01/08/2026 | Nolan Johnson, I-Connect007
The design dynamic duo, Design007 Magazine and the Design007 Week newsletter, covered a wide range of topics in 2025. Here are the top 10 design-related articles, columns and news reports for the year. This list, comprised of two columns, three articles, and five news items, relies entirely on readership numbers, making for as fair a comparison as possible. 
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