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DuPont Interconnect Solutions Advances Toward Sustainability Goal
April 24, 2023 | DuPontEstimated reading time: 1 minute

As part of DuPont’s Electronics & Industrial business, Interconnect Solutions (ICS)—a leading total solutions and systems design partner addressing signal integrity and power transmission challenges—is proud to announce another milestone in sustainability, by adopting solar energy in the Laminates manufacturing site in Taiwan. This accomplishment represents the business’ unwavering commitment to environmental stewardship and dedication to taking care of its people and the planet.
In 2021, ICS set a sustainability goal of reaching carbon-neutral operations for the global business segment by 2030. Before the end of 2021, ICS announced that it had already achieved 95 percent of global operations powered by renewable electricity. Its ambitious sustainability goals are focused in three areas: innovating safer by design, enabling a circular economy, and acting on climate change.
In less than two years, ICS has made significant strides in its environmental commitment, including this major milestone at the one of its manufacturing sites in Taiwan, Hsinchu Site 1. This site recently installed more than 1000 solar panels and attained its renewable energy and climate stewardship goals. By adopting solar energy, the site now generates approximately 3.2 percent of its energy capacity sustainably, while reducing CO2 emissions by about 310 tons per year. This milestone is roughly equivalent to planting 11 soccer fields with trees. The site continues to take action to save water and power while reducing copper consumption and raw materials packaging wastes from its daily operation.
“As a responsible and forward-thinking organization, sustainability has been a focal point for our business,” said Thean Ming Tan, Global Business Director, Laminates, ICS. “By joining Apple’s Supplier Clean Energy Program in 2022, DuPont has committed to using 100 percent renewable electricity in the manufacture of all our products for Apple. We also partner with our customers and suppliers to help them achieve their sustainability goals and reduce environmental impacts along the electronics industry value chain.”
He noted that with the evolution of consumer electronics becoming smaller, thinner, and more multifunctional, the need for advanced interconnects, such as flexible printed circuit materials and low-loss materials, will continue to grow. DuPont’s low-loss total solutions are designed for higher frequency and higher speed applications for 5G connectivity. DuPont™ Pyralux® Flexible Copper Clad Laminates (FCCLs) manufactured in ICS Hsinchu Site 1, are designed to be thinner and lighter, which enables design flexibility while maintaining excellent signal integrity.
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Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.