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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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DuPont Interconnect Solutions Advances Toward Sustainability Goal
April 24, 2023 | DuPontEstimated reading time: 2 minutes
As part of DuPont’s Electronics & Industrial business, Interconnect Solutions (ICS)—a leading total solutions and systems design partner addressing signal integrity and power transmission challenges—is proud to announce another milestone in sustainability, by adopting solar energy in the Laminates manufacturing site in Taiwan. This accomplishment represents the business’ unwavering commitment to environmental stewardship and dedication to taking care of its people and the planet.
In 2021, ICS set a sustainability goal of reaching carbon-neutral operations for the global business segment by 2030. Before the end of 2021, ICS announced that it had already achieved 95 percent of global operations powered by renewable electricity. Its ambitious sustainability goals are focused in three areas: innovating safer by design, enabling a circular economy, and acting on climate change.
In less than two years, ICS has made significant strides in its environmental commitment, including this major milestone at the one of its manufacturing sites in Taiwan, Hsinchu Site 1. This site recently installed more than 1000 solar panels and attained its renewable energy and climate stewardship goals. By adopting solar energy, the site now generates approximately 3.2 percent of its energy capacity sustainably, while reducing CO2 emissions by about 310 tons per year. This milestone is roughly equivalent to planting 11 soccer fields with trees. The site continues to take action to save water and power while reducing copper consumption and raw materials packaging wastes from its daily operation.
“As a responsible and forward-thinking organization, sustainability has been a focal point for our business,” said Thean Ming Tan, Global Business Director, Laminates, ICS. “By joining Apple’s Supplier Clean Energy Program in 2022, DuPont has committed to using 100 percent renewable electricity in the manufacture of all our products for Apple. We also partner with our customers and suppliers to help them achieve their sustainability goals and reduce environmental impacts along the electronics industry value chain.”
He noted that with the evolution of consumer electronics becoming smaller, thinner, and more multifunctional, the need for advanced interconnects, such as flexible printed circuit materials and low-loss materials, will continue to grow. DuPont’s low-loss total solutions are designed for higher frequency and higher speed applications for 5G connectivity. DuPont™ Pyralux® Flexible Copper Clad Laminates (FCCLs) manufactured in ICS Hsinchu Site 1, are designed to be thinner and lighter, which enables design flexibility while maintaining excellent signal integrity.
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I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/15/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.