-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Call-for-Participation Webinar Board-Level Optical Interconnect Performance in Immersion-Cooled Environments
April 24, 2023 | iNEMIEstimated reading time: Less than a minute

Join us April 25 to learn about iNEMI’s new Board-Level Optical Interconnect Performance in Immersion-Cooled Environments project. Immersion cooling is gaining traction as a means of disruptive thermal management in high-performance computing and data centers; however, there is insufficient understanding of how optical interconnect components will perform in immersion-cooled environments. This issue affects OEMs and companies involved with photonics integration, mid-board optics and co-packaged optics.
The objectives of this new project are to:
Investigate and evaluate different on-board optical components and interconnect solutions in different immersion-cooled environments including single phase and dual phase.
Understand how design factors of interconnect components affect performance in an immersion environment.
Registration
These sessions are open to industry; advance registration is required, visit iNEMI's website.
Session 1
April 25, 2023
10:15-11:00 a.m. CEST (Europe)
4:15-5:00 p.m. CST (China)
Session 2
April 25
10:00-11:00 a.m. EDT (US)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
ASMPT: New Stationary Camera for SIPLACE Placement Machines
03/13/2025 | ASMPTMarket and technology leader ASMPT is offering a new stationary camera available for its placement machines equipped with SIPLACE placement heads CPP and TWIN. It delivers significantly faster processing speeds as well as more component flexibility – from highly integrated ball grid arrays (BGAs) to large-format odd shape components (OSCs).
Statement from IPC, the Global Electronics Association, on Recent U.S. Tariffs and Global Trade
03/07/2025 | IPCIPC shared the following statement today on U.S. tariffs and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:
CELUS Drops BOM on Electronics Design Complexity
03/05/2025 | BUSINESS WIRECELUS, developer of the leading AI-assisted electronics design platform used by developers and engineers globally, unveiled a new bill of materials (BOM) experience that better satisfies the needs of electronic engineers by helping them choose the right components for the early stages of their PCB design.
2025 IEEE Electronic Components and Technology Conference
03/04/2025 | IEEEMore than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here.