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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Call-for-Participation Webinar Board-Level Optical Interconnect Performance in Immersion-Cooled Environments
April 24, 2023 | iNEMIEstimated reading time: Less than a minute

Join us April 25 to learn about iNEMI’s new Board-Level Optical Interconnect Performance in Immersion-Cooled Environments project. Immersion cooling is gaining traction as a means of disruptive thermal management in high-performance computing and data centers; however, there is insufficient understanding of how optical interconnect components will perform in immersion-cooled environments. This issue affects OEMs and companies involved with photonics integration, mid-board optics and co-packaged optics.
The objectives of this new project are to:
Investigate and evaluate different on-board optical components and interconnect solutions in different immersion-cooled environments including single phase and dual phase.
Understand how design factors of interconnect components affect performance in an immersion environment.
Registration
These sessions are open to industry; advance registration is required, visit iNEMI's website.
Session 1
April 25, 2023
10:15-11:00 a.m. CEST (Europe)
4:15-5:00 p.m. CST (China)
Session 2
April 25
10:00-11:00 a.m. EDT (US)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
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The Death of the Microsection
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