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Raytheon Technologies Unveils Next-Generation Electro-Optical Intelligent-Sensing Capability
April 25, 2023 | Raytheon TechnologiesEstimated reading time: 2 minutes
Raytheon Technologies announced the launch of RAIVEN, a revolutionary electro-optical intelligent-sensing capability, which will enable pilots to have faster and more precise threat identification.
RAIVEN can identify objects optically and spectrally simultaneously in real-time — a single electro-optical/infrared, or EO/IR, system has never been able to do this before.
RAIVEN's 'intelligent-sensing' capability uses artificial intelligence, hyperspectral imaging, and light detection and ranging, or LiDAR, to enable operators to see up to five times farther and clearer than traditional optical imaging. This helps increase platform survivability and gives the warfighter decision advantage over peer threats.
"The future battlespace will consist of a myriad of threats from all directions evolving at an unprecedented pace," said Torrey Cady, vice president of Surveillance and Targeting Systems at Raytheon Intelligence & Space. "RAIVEN improves platform survivability and keeps the warfighter safe by providing accurate, persistent target observation coupled with accelerated information sharing. This combination enables a decision-making process that simultaneously reduces pilot workload while accelerating engagement decisions to prosecute targets much faster than adversaries."
Paired with AI, RAIVEN synthesizes reams of data into a detailed picture of the battlespace and the threats within it. The AI automatically detects and identifies threats, delivering a level of automation for the operator to choose what decisions need to be made – providing a critical capability while drastically reducing operator workload.
RAIVEN is a modular, open system that builds upon the successes of Raytheon Technologies' combat-proven Multi-Spectral Targeting System family of sensors. RAIVEN provides more mission versatility and capability than ever before – all within the same size, weight and power specifications.
The first version of RAIVEN, RT-1000, can support a wide array of missions, including the U.S. Army's Future Vertical Lift modernization effort, with the first flight test being conducted in 2024.
Work for this program is being done in McKinney, Texas.
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SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic-Hesselink, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
Protecting Advanced Trucking Electronics in Harsh Environments
05/13/2026 | Beth Massey, MacDermid Alpha Electronics SolutionsFor decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.