American Standard Circuits to Exhibit at Connect (X) 2023
May 1, 2023 | American Standard CircuitsEstimated reading time: 1 minute
American Standard Circuits be exhibiting at Connect (X) 2023 to be held at the Morial Convention Center in New Orleans, LA from Monday, May 8th through Wednesday, May 10th.
Connect (X) showcases the leaders in 5G infrastructure: innovative technology, supporting professional services, and a partner ecosystem that enables ubiquitous communications between people, devices, machines and tools that support 21st century communications.
ASC president and CEO commented, “This is an excellent opportunity for us to meet like-minded companies who are interested in RF, connectivity and 5G technology. American Standard Circuits is tightly aligned with RF technology and will use this opportunity to continue expanding those capabilities to meet the PCB demands of the future.”
American Standard Circuits will be exhibiting at Connect (X) in Booth 509.
Be sure to check out additional educational content from American Standard Circuits:
- The Printed Circuit Designer’s Guide to…?Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator’s Perspective
- RealTime with… American Standard Circuits, three discussions: flex and rigid flex PCBs by Anaya Vardya and Dave Lackey; RF/microwave PCBS by Anaya Vardya and John Bushie; and thermal management by Anaya Vardya, John Bushie, and Dave Lackey
- You can also view other titles in our full I-007eBooks library.
Suggested Items
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.
BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of space-grade system-on-chip solutions, announce their collaboration to explore the integration of BrainChip’s AkidaTM neuromorphic processor into Frontgrade Gaisler’s next generation fault-tolerant, radiation-hardened microprocessors.