Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Nolan’s Notes: Soldering Technologies
MacDermid Alpha Presents at PCIM Europe
May 2, 2023 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Europe, held at the Nuremberg Exhibition Grounds, 9 - 11 May 2023. MacDermid Alpha’s expertise and product portfolio will be on display in hall 7, booth 460. Our team of experts look forward to welcoming visitors and sharing innovative solutions for increased power, range, and reliability in EVs (Electric Vehicles).
Save the date – 10th May at 10 am, The Industry Stage
Gyan Dutt, Strategic Marketing Manager for Semiconductor Assembly at MacDermid Alpha, will present a technical paper on the Industry Stage, hall 7, titled ‘Sintering Innovations for Power Electronics Packaging and Assembly’. Content will address different options for sinter attach layers for challenging applications beyond die attach. Gyan will cover solutions for novel form factors and processes for die top-side and module attach. Thermomechanical and power cycling reliability data for commercial modules benchmarked against solder – extending cycling improvement by as much as 10-30X will be part of the comprehensive session.
MacDermid Alpha is powering your path to enhanced reliability of power inverters. We achieve this by improving the consistency of sintered joints and enabling higher operating temperatures. Highlighted at the show will be:
- Argomax ® 2148, a recent addition to the portfolio, is ideal for sintering large packages or components on gold or silver substrates. A key advantage, its firm attachment to the inverter, and ability to cope with marginal component surfaces. Utilizing a pure silver bond line, the dispensable silver sintering paste exhibits excellent bond line thickness and adhesion. Argomax 2148, delivers excellent performance and reliability for inverters in extreme temperature swings.
- The ATROX® range offers superior reliability and performance with rapid heat dissipation for higher efficiencies and operating temperatures. The ATROX 800HT series, a thermosetting conductive die attach adhesives with high thermal conductivity (>70 W/m-K) are designed for the no-pressure assembly of high-power exposed pad semiconductor packages. The ATROX die attach and clip attach process provides low modulus materials for large die sizes as well as superior adhesion to copper clip surfaces. A leading high thermal film with excellent bond line control, ATROX CF200-1D, is an electrically conductive die attach film with thermal conductivity of >20 W/m-K with no die tilting resulting in a high-yield assembly process.
Julien Joguet, Director Power Modules, Inverters, and Industrial, said, “We are excited and looking forward to engaging with visitors at this year’s PCIM to not only demonstrate our ‘right first-time’ approach but to share our knowledge having worked on applications for power electronics in EV (Electric Vehicle) applications for over 15 years.”
Share on:
Suggested Items
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.