Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Micross Acquires Technograph Microcircuits
May 2, 2023 | PRNewswireEstimated reading time: 1 minute
Micross Components, a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical, energy, industrial and other applications, announced the acquisition of Technograph Microcircuits Ltd, a leading provider of hybrid integrated circuits, RF & microwave products, optoelectronics, and PCB assembly. The acquisition further expands the Hi-Rel Products & Services portfolio of Micross.
TechnoGraph, a privately held electronics manufacturer located in Portsmouth, UK, has established itself as a best-in-class supplier serving customers in the space, aerospace, defense, medical, automotive, telecommunications, and energy end markets with a leading portfolio of advanced electronic solutions for the most demanding operating environments. Technograph provides complete solutions comprising substrate, printing, chip and wire assembly, hermetic packaging, packaging test and reliability screening, as well as obsolescence management and reverse engineering. Technograph products are designed and tested to MIL-STD-883, and the operating facility maintains ISO 9001/14001/9450 quality certifications.
"We are excited to join the Micross team and expand the range of product offerings enabled by our combined capabilities. Micross' 'One Source, One Solution,' end to end product and services model makes it a valued partner to us and our customers, who expect the highest quality microelectronic solutions. This is a winning combination of product innovation and supply chain services for our high-reliability customers." said Brian Basford, Managing Director, TechnoGraph Microcircuits, Ltd.
Vincent Buffa, Chairman & CEO of Micross, stated, "The acquisition of Technograph will greatly expand Micross' proprietary portfolio of high-reliability MCM (multi-chip-module), ASIC, and PCB products and services, which will enhance overall product performance and reduce supply chain risk for the benefit of our customers. In addition, Micross will leverage the capabilities of its design, packaging, and test services to provide our customers with greater value from our 'one source, one solution' business model, providing them with the most advanced microelectronic solutions available."
Share on:
Suggested Items
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.