Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
iNEMI Call-for-Participation Webinar: PCB Connector Footprint Tolerance Project
May 4, 2023 | iNEMIEstimated reading time: 1 minute
Size reduction coupled with increased bandwidth is driving new and tighter PCB/FPC (flexible printed circuit) design requirements that may exceed the capability of fabrication processes used for previous generations of I/O connector interfaces. In short, connector land pattern tolerances drive process requirements not previously needed. An understanding of complex process interactions is necessary to identify processes to use, conduct risk assessment, and meet product quality requirements.
The purpose of iNEMI’s PCB Connector Footprint Tolerance project is to define methods that enable designers who are creating products with high I/O bandwidth connector footprints to use the collected industry capability and capacity data to determine appropriate mitigation for the required level of quality for a given product. This fast-turnaround project will:
- Provide better understanding of risks associated with high I/O bandwidth connector footprints
- Enable product designers to conduct risk assessments to determine optimum manufacturing processes to enable PCB suppliers to meet product quality requirements
- Reduce product qualification costs and associated time to market
Registration
Join us for our call-for-participation webinar to learn more about this new project. Two sessions are scheduled and are open to industry; advance registration is required, visit iNEMI's website.
Session 1
Tuesday, May 9, 2023
11:00 am. — 12:00 p.m. EDT (US)
5:00-6:00 p.m. CEST (Europe)
Session 2
Wednesday, May 10, 2023
7:00-8:00 a.m. CST (China)
7:00-8:00 p.m. EDT (US) on May 9
Share on:
Suggested Items
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
04/29/2025 | Mike Konrad -- Column: The Knowledge BaseFrom detecting voids under BGAs to solder defects in high-reliability applications, X-ray inspection has become an indispensable tool in modern manufacturing. But how is the technology evolving? What challenges do experts face in deploying X-ray inspection effectively and what does the future hold for this critical quality assurance method?
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
Altus Helps FermionX Enhance Production with Advanced Inspection Solutions
04/29/2025 | Altus GroupAltus Group, a leading supplier of capital equipment for the electronics industry in the UK and Ireland, has supported Contract Electronics Manufacturer (CEM) FermionX in upgrading its Automated Optical Inspection (AOI) system to meet the increasing demand for enhanced precision and faster production cycles.
NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
04/28/2025 | PRNewswireNEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.
Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
04/23/2025 | BUSINESS WIREAlphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, bolsters its leadership in foundational AI silicon connectivity subsystems through silicon proven chiplets and IP subsystems on advanced process nodes and package types. This is set to be showcased at the TSMC 2025 North America Technology Symposium.