Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Rehm Releases Webinars on Manufacturing Processes in the Electronics Industry
May 8, 2023 | Rehm Thermal SystemsEstimated reading time: 2 minutes
In May, June and July, the event calendar of Rehm Thermal Systems is filled with new webinars on numerous topics relating to the world of electronics manufacturing. In May, the focus will initially be on the manufacturing of electronic components for medical technology, before switching in June and July to the process monitoring tool ProMetrics, condensation and contact soldering as well as soldering in a nitrogen atmosphere and the protection of electronics by conformal coating. The webinars provide theoretical background knowledge and give insights into the practical application of Rehm's systems.
You can register online for the webinars at Rehm Thermal Systems. The registration links for the webinars in June and July will be activated shortly.
May 25th, 2023 / 9:00 a.m. and 4.00 p.m. CET
Live webinar: electronics in medical technology (English)
From hospital technology to imaging diagnostics and sensor technology – a wide range of medical technology relies on electronics solutions that must meet the highest standards in all areas. In our webinar, you will learn how you can use Rehm's numerous process engineering solutions in the manufacture of your electronic components for medical technology. Our experts will present the relevant application areas and systems in detail and will be happy to answer your questions afterwards.
The German-language webinar on this topic will take place on May 24th at 9:00 CET.
June 15th, 2023 / 9:00 a.m. and 4.00 p.m. CET
Live webinar: ProMetrics – profiling and monitoring of the soldering process (English)
ProMetrics was developed for the monitoring of thermal profiles during the soldering of electronic assemblies. The software integrated into the ViCON interface monitors how well the profile created meets the required, predefined specifications. A representation of the envelope curve graph visualises discrepancies in the temperature profile of the specified temperatures. ProMetrics can be used for single and double track systems with or without vacuum.
The German-language webinar on this topic will take place on June 14th at 9:00 CET.
June 22nd, 2023 / 9.00 a.m. and 4.00 p.m. CET
Live webinar: Nexus/Condenso - soldering beyond convection (English)
In addition to convection soldering systems, Rehm is the only manufacturer in the world that also offers contact soldering systems as well as condensation or vapour phase soldering systems from a single source. The Condenso series for condensation soldering, for example, is particularly suitable for processing large and heavy boards. With the system variants of the Condenso series, not only can vacuum processes be reliably implemented at any time, they also offer maximum process reliability in all areas, whether in batch operation, inline connection or during continuous soldering. The Nexus contact soldering system, in turn, guarantees the best results through reflow soldering processes with contact heat under vacuum – thereby meeting the highest requirements in the field of advanced packaging and power electronics. In our webinar we will inform you about the different application areas, the opportunities and advantages of vapour phase soldering as well as the contact soldering process.
The German-language webinar on this topic will take place on June 21st at 9:00 CET.
July 6th, 2023 / 9.00 a.m. and 4.00 p.m. CET
Live webinar: soldering in a nitrogen atmosphere (English)
Convection soldering in a nitrogen atmosphere has been outstandingly successful worldwide since the 1990s. The advantages of soldering in a nitrogen atmosphere – a larger soldering window, fewer soldering defects, and the avoidance of surface oxidation – are still decisive for the reliability of solder joints today. In our webinar, Rehm experts explain the influence of nitrogen on reflow soldering and discuss ways to reduce nitrogen consumption.
The German-language webinar on this topic will take place on July 5th at 9:00 CET.
Participation in the webinars is free of charge.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.