Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Nordson Test & Inspection Systems Demonstrates Inspection and Metrology Systems at SMTConnect 2023
May 9, 2023 | Nordson Test & Inspection SystemsEstimated reading time: 1 minute
Nordson Test & Inspection Systems announced that it will exhibit at SMTConnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will feature the multi-award-winning CyberOptics SQ3000 Multi-Function system for AOI, SPI and CMM, along with the X3 AXI system in Hall 4, Stand 216 with SmartTec.
The CyberOptics SQ3000 Multi-Function system, deemed best-in-class, can identify critical defects and measure critical parameters, in order to fix what can be found and control what can be measured. In addition to AOI and SPI applications, highly accurate coordinate measurements can be attained faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours.
Powered by proprietary Multi-Reflection Suppression® (MRS®) sensor technology, the 3D SQ3000 all-in-one system offers an unmatched combination of high speed, high resolution and high accuracy. The MRS sensor meticulously identifies and rejects reflections caused by shiny components and surfaces, making it an ideal technology solution for a wide range of applications, particularly high-end and challenging applications with stringent quality requirements.
“Since the close of the acquisition last November, CyberOptics systems have complemented Nordson TEST & INSPECTION 's broad portfolio with its world-leading optical inspection and metrology technology powered by MRS technology,” said Perry Duffill, VP of Nordson TEST & INSPECTION. "Having established a leading position in the X-ray inspection systems market, I am pleased that our fundamental expertise in X-ray technology is coupled with industry leading automated optical technology to improve our customers yields, processes and productivity. Plus, our application experts can ensure seamless transitions from one system to another, enabling the entire electronics manufacturing process in Nordson's SMT and semiconductor markets to be designed with interlocking systems.”
The AXI X-Series is a dedicated autonomous high-speed inline X-ray inspection system for the inspection of PCB assemblies in single or multi panels or in workpiece carriers. The system offers market-leading inspection speed and is ideal for electronics manufacturing with high throughput requirements. The X series is characterized by a high degree of flexibility and configurability. Microfocus X-ray tube, in-house detector from the Quadra series from Nordson MXI and the latest 3D analysis architecture as well as a comprehensive software environment guarantee complete traceability via customer-specific MES and SECS/GEM interfaces.
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).