Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
NextFlex Calls for 3D Imaging Technology Proposals
May 10, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
Nolan Johnson talks with Scott Miller about a special "Open Project" call for proposals which NextFlex currently is exploring for methods to dewarp 3D scans of physical boards to enable multi-image scans to be stitched together. There is the possibility of funding for viable proposals. Deadline is May 15, 2023.
About NextFlex Project Calls
Along with developing the workforce of the future and promoting a sustainable advanced manufacturing ecosystem, NextFlex is also focused on accelerating flexible electronics technology innovation and commercialization through pre-competitive partnerships.
Via a series of Project Calls that provide cash awards to proposal teams for development projects that are critical to Flexible Hybrid Electronics (FHE) manufacturing, NextFlex underwrites up to 50% of the development costs of selected projects. The Project Call process follows a structured selection process and rigorous oversight methodology to ensure diversity and breadth in the selection of projects funded.
About Open Project Calls
Opportunities exist to move the Flexible Hybrid Electronics (FHE) industry forward that are either outside the scope of traditional Project Call topics or are revolutionary ideas of which the NextFlex Technical Working Groups and community may not be aware. The Open Project Call has been established to respond to these advanced manufacturing and flexible electronics opportunities through an RFI (Request for Ideas), to which proposers may submit a white paper. Learn more.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
10/07/2025 | Team Alpha -- Column: Alpha Insights: Performance by DesignFor years, Midwest PCB manufacturing was often viewed as a low-cost, high-volume business—good for standard builds but not for the high-reliability programs that demand tight process control. Defense primes and medical OEMs frequently turned to coastal or overseas suppliers for advanced work.
India: A Rising Exporter Still Dependent on Global Inputs
09/29/2025 | Global Electronics AssociationIndia has long been viewed as a country with vast potential in electronics manufacturing. Its large population, low labor costs, and growing domestic demand have made it an attractive destination for global companies looking to diversify production beyond China. In recent years, that potential has begun to materialize. Between 2017 and 2023, India emerged as one of the fastest-growing sources of finished electronics imports globally. This rapid expansion has been built on a foundation of imported components.
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.