Dan’s Biz Bookshelf ‘House of Huawei'
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
Fine-Line Circuits Ltd - India to Exhibit at International Microwave Symposium (IMS) 2023
May 15, 2023 | Fine-Line Circuits Ltd - IndiaEstimated reading time: 1 minute
Abhay Doshi, Managing Director of Fine-Line Circuits Ltd, has announced that his company will be exhibiting at this year’s International Microwave Symposium (IMS) to be held June 11-17 at the San Diego Convention Center in San Diego, CA.
It is Fine-Line’s mission to provide PCBs and PCBAs that deliver to the customer the RF performance they expect. They achieve this by working with every customer from the start through material selection, design optimization and final simulation, material stocking, PCB fabrication, and PCBA assembly to ensure expected precise RF performance.
When making this announcement Mr. Doshi said, “This is an excellent symposium and exhibition for us as we continue to increase our share of PCB supplies to the RF market. For a number of years now have been focused on RF and Microwave Systems requirements and the IMS 2023 symposium gives us the opportunity to talk to other like-minded individuals about this growing segment of the Electronics market. We look forward to meeting and talking with potential partners and customers in San Diego in June.”
Fine-Line Circuits will exhibiting in Booth 1713 sharing their expertise on providing the ideal surface finish for RF Microwave PCBs – Electrolytic Thick Gold Direct on Copper which gives a great skin and no Nickel related signal losses giving the designer the precise RF performance that the system is designed for.
Fine-Line has built a variety of PCB boards (hybrids, cavities, copper back, oversized PCBs) for a variety of Space and Defense Applications and other various systems (satcoms, radar, antenna, dividers, amplifiers, etc).
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.