Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Fine-Line Circuits Ltd - India to Exhibit at International Microwave Symposium (IMS) 2023
May 15, 2023 | Fine-Line Circuits Ltd - IndiaEstimated reading time: 1 minute
Abhay Doshi, Managing Director of Fine-Line Circuits Ltd, has announced that his company will be exhibiting at this year’s International Microwave Symposium (IMS) to be held June 11-17 at the San Diego Convention Center in San Diego, CA.
It is Fine-Line’s mission to provide PCBs and PCBAs that deliver to the customer the RF performance they expect. They achieve this by working with every customer from the start through material selection, design optimization and final simulation, material stocking, PCB fabrication, and PCBA assembly to ensure expected precise RF performance.
When making this announcement Mr. Doshi said, “This is an excellent symposium and exhibition for us as we continue to increase our share of PCB supplies to the RF market. For a number of years now have been focused on RF and Microwave Systems requirements and the IMS 2023 symposium gives us the opportunity to talk to other like-minded individuals about this growing segment of the Electronics market. We look forward to meeting and talking with potential partners and customers in San Diego in June.”
Fine-Line Circuits will exhibiting in Booth 1713 sharing their expertise on providing the ideal surface finish for RF Microwave PCBs – Electrolytic Thick Gold Direct on Copper which gives a great skin and no Nickel related signal losses giving the designer the precise RF performance that the system is designed for.
Fine-Line has built a variety of PCB boards (hybrids, cavities, copper back, oversized PCBs) for a variety of Space and Defense Applications and other various systems (satcoms, radar, antenna, dividers, amplifiers, etc).
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.