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Altus Recommends Advanced Vapour Phase Soldering to Increase Manufacturers’ Production Capacity
May 15, 2023 | Altus GroupEstimated reading time: 1 minute

Having worked with Altus Group for several years, Axiom Manufacturing Services consulted with the equipment distributor and invested in a cutting-edge vapour phase soldering system from ASSCON. ‘VP6000’ will increase production capacity and ensure highly flexible soldering of complex PCBA assemblies can be achieved to support the company’s wider customer base and broad range of applications.
ASSCON VP6000 is the ideal process for modern soldering technology. Electronic assemblies can be soldered faultlessly in each configuration, with flexible and adjustable temperature gradients to ensure each product receives the optimal, reproducible temperature profile.
Rob Taylor, Operations Manager at Axiom said: “I am delighted that we will soon have the ASSCON VP6000 on site and are bringing in a brand-new process to support our customers. This will mean that we have yet another capability to meet production needs allowing us to compete strongly with other electronics manufacturing services going forward.
“We are seeing many more complicated and component dense applications coming through with a large focus on voiding percentages. The VP6000, which is considered the best batch vapour phase unit available today, will support us in meeting all of those needs.’’
VP6000 is capable of working on any design and size assembly, proficiently manufacturing small and large production quantities using workpiece carriers. With the patented Multi Vacuum technology, voids in solder joints are reduced, with
Joe Booth, Altus CEO, said: “Altus and Axiom have developed a lot of trust over time, and I am really pleased for us both on this project. Altus can support another process at their site, and Axiom has invested in a flagship, leading vapour phase system with vacuum providing them with a real competitive advantage. Axiom always has an eye to improve their offering and cement their market leading position. They can now offer even more value to their customers and future-proof their relationships.”
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Brent Fischthal - Koh YoungSuggested Items
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10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
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Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
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