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Altus Recommends Advanced Vapour Phase Soldering to Increase Manufacturers’ Production Capacity
May 15, 2023 | Altus GroupEstimated reading time: 1 minute
Having worked with Altus Group for several years, Axiom Manufacturing Services consulted with the equipment distributor and invested in a cutting-edge vapour phase soldering system from ASSCON. ‘VP6000’ will increase production capacity and ensure highly flexible soldering of complex PCBA assemblies can be achieved to support the company’s wider customer base and broad range of applications.
ASSCON VP6000 is the ideal process for modern soldering technology. Electronic assemblies can be soldered faultlessly in each configuration, with flexible and adjustable temperature gradients to ensure each product receives the optimal, reproducible temperature profile.
Rob Taylor, Operations Manager at Axiom said: “I am delighted that we will soon have the ASSCON VP6000 on site and are bringing in a brand-new process to support our customers. This will mean that we have yet another capability to meet production needs allowing us to compete strongly with other electronics manufacturing services going forward.
“We are seeing many more complicated and component dense applications coming through with a large focus on voiding percentages. The VP6000, which is considered the best batch vapour phase unit available today, will support us in meeting all of those needs.’’
VP6000 is capable of working on any design and size assembly, proficiently manufacturing small and large production quantities using workpiece carriers. With the patented Multi Vacuum technology, voids in solder joints are reduced, with
Joe Booth, Altus CEO, said: “Altus and Axiom have developed a lot of trust over time, and I am really pleased for us both on this project. Altus can support another process at their site, and Axiom has invested in a flagship, leading vapour phase system with vacuum providing them with a real competitive advantage. Axiom always has an eye to improve their offering and cement their market leading position. They can now offer even more value to their customers and future-proof their relationships.”
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.