Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Altus Continues to Build on its Strong Relationship with Scienscope
May 22, 2023 | Altus GroupEstimated reading time: 1 minute
Since adding Scienscope’s range of inspection solutions to its portfolio, Altus Group, a leading supplier of capital equipment for the electronics industry, has seen increasing interest in their technology. With the launch of Xspection 3000 this year, the success story is set to continue.
The new Xspection 3000 X-ray machine is a flexible high-resolution system designed for circuit board defect detection and quality insurance. In addition, it offers batch inspection capabilities providing valuable statistics for SMT line process improvements.
Originating from the Scienscope X-scope 3000, the Xspection 3000 was developed following years of experience, the latest AI software, and customer input. The software's foundations remain unchanged and include automatic void calculation, automatic reporting and measurement capabilities. The system has been updated with added functionality at a competitive price and uses innovative technology to inspect many applications, including multilayer PCBs, voids, semiconductors, THT, and Li batteries.
Joe Booth, Altus CEO said: “The Scienscope range has been a perfect fit for the UK and Ireland markets because of its price-to-image quality and performance ratio. Together with the Altus Group support team, it has resulted in a massive increase in the number of installations and new customers over the last 36 months in the CEM space.
“X-rays are perceived as a ‘luxury’ piece of equipment because of their cost, but Scienscope has been able to break that mould with a very capable closed tube system that meets customer needs and makes having an X-ray onsite a reality.
“Xspection 3000 is a great new addition to their portfolio as it standardises the platforms to help with equipment cost. With the range of options available, we can still supply to customers who require the most advanced solution to cope with complex double-sided products, down to the simplest single-sided inspection. I’m looking forward to seeing many more new users utilising Scienscope in the future.”
Available in two main variants, the conventional 100kV version and the top-of-the-line 130kV version, the Xspection 3000 is the ideal solution for manufacturers looking to enhance their quality control processes. There are additional features that can be added including a 365 degree retrofit table rotating table, and up grading from the standard 45 degree oblique angle tilt to a 70 degree angle for the more complex double sided inspection.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).