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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Latest I-007eBook from GEN3 Focuses on Process Control
May 25, 2023 | I-Connect007Estimated reading time: Less than a minute
I-007eBooks is pleased to announce the release of the latest book in its The Printed Circuit Assembler’s Guide to…™ series.
The Printed Circuit Assembler's Guide to...™ Process Control, brought to you by GEN3 Systems and I-007eBooks, tackles critical aspects related to process control and the role of the SEC test in maintaining and providing objective evidence.
Written by GEN3 topic experts Dr. Chris Hunt and Graham Naisbitt, this book covers everything from 'open' and 'closed' loop circulation, corrosion prevention and ECM avoidance, to SIR tests for process verification, equipment and solution choices, and more. Readers will gain valuable insight into optimizing their assembly operations.
According to peer reviewer Mike Cummings: “This book is not based on fear marketing, but rather is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes.”
Download your free copy today here, as well as the first book in this two-part series, The Printed Circuit Assembler’s Guide to…™ Process Validation.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Process Control. View our full library at I-007eBooks.com.
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Simon Khesin - Schmoll MaschinenSuggested Items
Nordson Test & Inspection Partners with Quiptech Mexico to Expand Market Presence
05/05/2026 | Nordson Test & InspectionNordson Test & Inspection, a global leader in test, inspection and metrology solutions for semiconductor and SMT markets, announced a strategic partnership with Quiptech Mexico (a trading name of QTEK Mexico).
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.
NASA Fires Up Powerful Lithium-Fed Thruster for Trips to Mars
05/04/2026 | NASA JPLA novel electromagnetic thruster passed an initial test in a specialized chamber at JPL. With further development, these thrusters could support human missions to the Red Planet.
JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work
04/28/2026 | JAVAD EMSJAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?