-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Latest I-007eBook from GEN3 Focuses on Process Control
May 25, 2023 | I-Connect007Estimated reading time: Less than a minute
I-007eBooks is pleased to announce the release of the latest book in its The Printed Circuit Assembler’s Guide to…™ series.
The Printed Circuit Assembler's Guide to...™ Process Control, brought to you by GEN3 Systems and I-007eBooks, tackles critical aspects related to process control and the role of the SEC test in maintaining and providing objective evidence.
Written by GEN3 topic experts Dr. Chris Hunt and Graham Naisbitt, this book covers everything from 'open' and 'closed' loop circulation, corrosion prevention and ECM avoidance, to SIR tests for process verification, equipment and solution choices, and more. Readers will gain valuable insight into optimizing their assembly operations.
According to peer reviewer Mike Cummings: “This book is not based on fear marketing, but rather is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes.”
Download your free copy today here, as well as the first book in this two-part series, The Printed Circuit Assembler’s Guide to…™ Process Validation.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Process Control. View our full library at I-007eBooks.com.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Würth Elektronik Expands Laboratory in Shenzhen, China
04/17/2026 | Wurth ElektronikWürth Elektronik eiSos Group celebrated the official opening of the Laboratory Phase II at its Asia Quality Design Center (QDC Asia) in Shenzhen on March 5, 2026.
Würth Elektronik Expands Laboratory in Shenzhen, China
04/16/2026 | Wurth ElektronikWürth Elektronik eiSos Group celebrated the official opening of the Laboratory Phase II at its Asia Quality Design Center (QDC Asia) in Shenzhen on March 5, 2026.
Teradyne Acquires TestInsight, Accelerating Time to Market for AI and Data Center Devices
04/16/2026 | BUSINESS WIRETeradyne, Inc., a leading provider of automated test equipment (ATE) and advanced robotics, announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.
Synopsys Solutions Support NASA's Artemis Program with Spacesuit Analysis and Communication System Development
04/14/2026 | PRNewswireNASA selected Synopsys, Inc. and EMA to verify spacesuit compatibility with the lunar environment.