-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
A Look Back at 2025
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Mark Laing Talks ‘Sustainability in Manufacturing’
May 24, 2023 | I-Connect007Estimated reading time: Less than a minute
Now available on I-007e and Spotify, Episode 3 of I-Connect007’s new podcast, On the Line with… features an interview with Mark Laing, business development manager for digital industries software at Siemens. Laing discusses the role of electronics in achieving sustainability. Not only does the electronics industry have a primary role to play here, but it also contributes by creating products which enable other industries to monitor and optimize their sustainability practice.
The On the Line with... podcast series is the latest way I-Connect007 is committed to providing readers (and listeners) with a wide range of digital content and information to help them succeed in the industry. From magazines, books and newsletters to market reports and event coverage, we offer a variety of digital content to suit the needs of our reader community presented by the industry sector.
I-Connect007, part of the IPC Publishing Group Inc., is the industry's longest-running media company and leading publisher of original, exclusive content for the global electronics industry.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Kitron Raises Outlook on Defense Super Cycle as Q4 Delivers Record Results
02/12/2026 | KitronKitron reported record quarterly revenue and operating profit, driven by accelerating demand in the defense/aerospace market sector. An all-time high order backlog also provides strong visibility for 2026.
I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
02/12/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
Advanced Rework Technology Named IPC Electronics Training Provider of the Year
02/12/2026 | Advanced Rework TechnologyAdvanced Rework Technology (A.R.T.), a UK-based provider of IPC-certified electronics training and independent technical consultancy, has been named Electronics Training Provider of the Year as part of the 2026 Awards of Excellence programme.
DuPont Reports Q4, Full Year 2025 Results
02/11/2026 | PRNewswireDuPont announced its financial results for the fourth quarter and full year ended December 31, 2025 and initiated financial guidance for the first quarter and full year 2026.
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
02/11/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.