Heraeus Electronics, Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology
May 24, 2023 | Heraeus ElectronicsEstimated reading time: 1 minute
Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany. The agreement allows Heraeus Electronics to access a valuable patent portfolio from Bosch to accelerate the development of their inorganic potting compound, CemPack®, for encapsulation of power modules.
“The combination of expertise between Heraeus and Bosch enables a new type of encapsulants that will bring power electronic packages to the next level so that these packages can unfold the full potential of a new generation of semiconductors,” said Dr. Klemens Brunner, Head of Heraeus Electronics.
The encapsulation material offers superior thermal conductivity (>5 W/m/K) and extreme temperature resistance (up to 300°C), enabling increased power densities and improved reliability. The license agreement also allows the extension of the application spectrum to encapsulation of passive components (magnetics, capacitors, or resistors), electric motors (stators), or other devices where a thermal bridge to a heat sink is required while ensuring protection against the environment.
“Collaborations like these show the importance of open innovation to speed up development cycles and it is a great example for the innovation power of Heraeus,” said Michael Jörger, Head of Business Line Power Electronic Materials at Heraeus Electronics.
“We are excited to share our knowledge and IP of this new technology with Heraeus to deliver inorganic potting compounds meeting the highest standards of performance and reliability. Like Bosch, Heraeus is committed to excellence and has a reputation of shaping the market with innovative products,” said Dr. Peter Wolfangel, EVP Corporate Sector Research and Advance Engineering at Bosch.
The agreement is significant given the increasing demand for power modules as key components of the transition towards electrification. With its existing material portfolio for packaging and interconnection of semiconducting power dies, Heraeus Electronics already offers cutting-edge solutions for power electronics such as sinter paste, DTS, and Ag-free AMB.
Suggested Items
iNEMI Announces Member Recognition Awards for 2024
06/28/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) announces the recipients of this year’s membership recognition program.
IPC White Paper Emphasizes the Critical Importance of ‘Design for Excellence’ Throughout the Full Ecosystem of Electronics Design
06/27/2024 | IPCA new white paper from IPC’s Chief Technologist (CTC) and Design Leadership (DLC) Councils, Better Electronics by Design: Next Generation Design Needs explores the elements of the “Design for Excellence” methodology, re-thinking how it needs to be further defined and applied in the full ecosystem of electronics design.
IPC K-FEST Set to be IPC’s Landmark Event in Korea
06/27/2024 | IPCIPC K-FEST is set to be IPC’s landmark event in Korea on Oct 29, 2024, bringing together industry peers to celebrate the advancements and contributions that have shaped the landscape of electronics standards and technology.
EMS Market Size to Grow $735,390 Million by 2030 at a CAGR of 4.8%
06/27/2024 | PRNewswireThe Electronics Manufacturing Services (EMS) Market was estimated to be worth USD 509100 Million in 2023 and is forecast to a readjusted size of USD 735390 Million by 2030 with a CAGR of 4.8% during the forecast period 2024-2030.
Daeduck Electronics Developed Large Body FCBGA Substrate for Data Centers
06/26/2024 | BUSINESS WIREEstablished in 1965, Daeduck Electronics holds the distinction of being Korea's pioneering mass-producer of PCBs (Printed Circuit Boards), thus contributing significantly to the advancement of the nation's electronics sector for over six decades.