Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
The Knowledge Base: Cultivating Your Brand in the Age of Connection
SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 2
Cetec ERP to Showcase Integration Capabilities at Zuken Innovation World
May 25, 2023 | Cetec ERPEstimated reading time: 1 minute
Cetec ERP is pleased to announce plans to exhibit at Zuken Innovation World Americas + Integrate23. The event is scheduled to take place June 5-8, 2023 in Scottsdale, AZ.
As a trusted provider of comprehensive ERP solutions, Cetec ERP will demonstrate its seamless integration capabilities by showcasing a live demonstration of pushing a Bill of Materials (BOM) from the Computer-Aided Design (CAD) software directly into the Cetec ERP system. This integration enables efficient production tracking, real-time inventory management, and streamlined workflows for manufacturers.
During the event, attendees will witness how the integration, leveraging Open APIs, between a CAD software and Cetec ERP enables a smooth transfer of critical product data, including components, quantities, and specifications. This streamlined process allows manufacturers to automatically generate production orders, track progress, and manage inventory levels accurately.
"We understand the importance of providing manufacturers with a complete solution that optimizes their production processes," added Ryan. "Our Open APIs allow integration with CAD software, empowering manufacturers to make informed decisions, improve efficiency, and enhance overall productivity."
Zuken Innovation World brings together professionals and experts in the fields of electrical and electronic engineering, offering a platform for networking, knowledge sharing, and exploring the latest advancements in technology. Cetec ERP's participation at this prestigious event reinforces its commitment to delivering innovative solutions that meet the evolving needs of manufacturers.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.
MacDermid Alpha Electronics Solutions Announces New Strategy Vice President Role for India
08/14/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.
Changes in Management Positions at Würth Elektronik eiSos Group
08/14/2025 | Wurth Elektronik eiSosWürth Elektronik, a leading manufacturer of electronic and electromechanical components for the electronics industry, announces two new appointments at the management level: Dirk Knorr has taken over the position of COO of the Würth Elektronik eiSos Group, and Sebastian Valet has taken over his previous position as Managing Director of Würth Elektronik eiSos GmbH & Co. KG.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.