Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Sustainability in Logistics: Reducing Your Carbon Footprint
May 31, 2023 | I-Connect007Estimated reading time: Less than a minute
Now available on I-007e Podcasts and Spotify, Episode 4 of I-Connect007’s new podcast, On the Line with… features an interview with Christian Wendt, marketing and communications department head at Siemens Digital Logistics. Wendt discusses the most obvious area of concern for logistics sustainability: reduction of the carbon footprint. Fossil fuel costs are one thing, but Wendt explains a wide variety of logistics-related areas to consider, ranging from employee burnout to governmental regulations and how they vary from country to country.
The On the Line with... podcast series is the latest way I-Connect007 is committed to providing readers (and listeners) with a wide range of digital content and information to help them succeed in the industry. From magazines, books and newsletters to market reports and event coverage, we offer a variety of digital content to suit the needs of our reader community presented by the industry sector.
I-Connect007, part of the IPC Publishing Group Inc., is the industry's longest-running media company and leading publisher of original, exclusive content for the global electronics industry.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Mycronic Secures Turnkey Solution Order from a Nordic Defense Actor
11/05/2025 | MycronicMycronic has received a full-line, ready-to-use solution order from a major defense industry supplier based in the Nordic region. The order encompasses a complete solution for advanced circuit board manufacturing, including high-tech production equipment and integrated software systems.
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.