-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
TTM Announces Closing of New Term Loan Facility and New U.S. ABL Facility
May 31, 2023 | Globe NewswireEstimated reading time: 1 minute

TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (“PCBs”), announced the closing and syndication of a new $350 million senior secured term loan (the “New Term Loan Facility”) and the closing of a new U.S. asset-based revolving credit facility with committed borrowing capacity of $150 million (the “New U.S. ABL Facility”).
The New Term Loan Facility, which matures May 2030, amends and restates TTM’s previous senior secured term loan facility that was scheduled to mature in September 2024, under which $356 million of indebtedness was outstanding. TTM used the proceeds from its New Term Loan Facility to refinance $350 million of such outstanding indebtedness and used cash on hand to pay the remaining indebtedness as well as to pay related fees and expenses. The New U.S. ABL Facility amends and restates TTM’s previous $150 million U.S. asset-based revolving credit facility, which was scheduled to mature in June 2024.
The New Term Loan Facility was priced at an interest rate of Term SOFR + 2.75%. The new Term B Loans were issued with a 1.0% original issue discount. Annual cash interest expense is expected to increase by $0.9 million.
The maximum availability under the New U.S. ABL Facility is $150 million. The New U.S. ABL Facility is scheduled to mature in May 2028 and has a borrowing rate of Term SOFR plus a margin ranging from 1.35% to 1.6%.
As a result of these transactions, annual non-cash interest expense will increase approximately $0.3 million and TTM will record, in the second quarter of 2023, a non-cash expense of approximately $1.3 million for the write off of debt issuance costs.
The New Term Loan Facility was entered into with J.P. Morgan acting as administrative agent and joint lead arranger. Other joint lead arrangers for the New Term Loan Facility were BofA Securities, Inc., Barclays Bank PLC, Truist Securities, Inc. and HSBC Securities (USA) Inc. The New U.S. ABL Facility was entered into with J.P. Morgan acting as administrative agent.
Suggested Items
Eltek Reports Full Year and Q4 2024 Financial Results
03/13/2025 | EltekEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.
Apple’s Year-End Production Peak and China’s Subsidy Policies Drive 9.2% QoQ Growth in 4Q24 Smartphone Production
03/11/2025 | TrendForceTrendForce reports that global smartphone production in the last quarter of 2024 reached 334.5 million units, reflecting a 9.2% QoQ increase, driven by Apple’s peak production season and consumer subsidies from local Chinese governments.
IDC Adjusts PC and Tablet Forecasts but Still Expects Commercial Demand to Provide Growth
03/04/2025 | IDCIn the wake of the USA’s tariffs on China as well as a weakening market sentiment, mostly in the consumer space, IDC has reduced its traditional PC forecast in 2025 and beyond. Global PC volume is now expected to reach 273 million in 2025, still growing +3.7% over the prior year though this is a slight reduction from the prior forecast.
HANZA Completes Leden Group Oy Acquisition; Broadens Customer Base and Strengthens Mechanical Expertise
03/03/2025 | HANZAHANZA AB has completed the acquisition of the Finnish billion SEK company Leden Group Oy, a leading player in advanced mechanical manufacturing.
Wistron Announces 2024 Financials and BOD Results
02/27/2025 | WistronWistron Corp. held a Board of Directors meeting and announced its financial results for 2024. The company reported consolidated revenue of NTD 1,049 billion, operating income of NTD 38,980 million, profit before tax (PBT) of NTD 40,057 million, and profit after tax (PAT) of NTD 17,439 million, with earnings per share (EPS) of NTD 6.11.