-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSupply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
MKS Introduces ESI Geode A CO2 Laser System for High Precision and High-Speed ABF IC Substrate Manufacturing
May 31, 2023 | MKS Instruments, Inc.Estimated reading time: 1 minute

MKS Instruments, Inc., a global provider of technologies that transform our world, announced the official launch of the ESI Geode® A laser drill system today, a new configuration of the Geode® platform designed explicitly for drilling vias in the non-copper-clad ABF substrate market.
The Geode® A laser drilling system provides processing and application solutions for the FCBGA package substrate market, components which provide critical building blocks for everyday electronic devices and, in particular, high-performance computing. FCBGA substrates help enable supercomputing, artificial intelligence processing, autonomous cars, and other highly complex semiconductor modules.
“Manufacturers are under increased market pressure to deliver components that meet the precise demands of miniaturization and complexity required for advanced substrate manufacturing. At MKS, we are keenly focused on delivering the advanced technology needed for our customers to deliver next-generation productivity and quality,” said John Williams, MKS Vice President and General Manager of the ESI business. “In addition, the Geode® A laser drill is engineered as an integral component to the MKS Optimize the Interconnect SM solution, combining ESI laser drilling technologies with Atotech chemistry and plating equipment to provide customers with a full package of via formation technologies required to deliver optimal quality with the highest productivity for PCB and package substrate products.”
The Geode® A laser drilling system combines an innovative laser and optics configuration with precision pulse-shaping and beam-steering designed for ABF materials. These engineering innovations deliver the lowest cost of ownership and a greener manufacturing solution through 21% less floor space utilization, 72% less weight, and up to 65% less power consumption than the competition.
The Geode® A laser drilling system is available for purchase. More details can be found at www.esi.com, and system experts will be available at the JPCA 2023, Tokyo, Japan, May 31-June 2 in booth 6B-11.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs
07/31/2025 | Global Electronics AssociationWe are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.