Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Northrop Grumman Advances the Frontier of Sensing Technology for Space Domain Awareness
June 1, 2023 | Northrop GrummanEstimated reading time: 1 minute
Northrop Grumman Corporation continues to advance the frontiers of sensing technology, successfully completing the Critical Design Review (CDR) and software demonstration for the U.S. Space Force’s (USSF) Deep-Space Advanced Radar Capability Program (DARC).
Key milestones completed within 12 months of contract award include:
- Preliminary Design Review
- Critical Design Review
- Initial software demonstration
- Northrop Grumman Advances the Frontier of Sensing Technology for Space Domain Awareness
- Artist Rendering (Credit: Northrop Grumman)
Expert:
“DARC will be the first to provide an all-weather, at all times capability in support of the space domain awareness mission that’s critical to national and global security,” said Pablo Pezzimenti, vice president, integrated national systems, Northrop Grumman. “The successful critical design review is demonstration of our ability to develop a complex, advanced system with agility and speed.”
Details:
Following the completion of CDR, the program now turns its focus to the Factory Acceptance Testing of key subsystems starting later this year.
Current ground-based optical systems only operate at night and are impacted by weather conditions. DARC will deliver an all-weather, 24/7 capability to monitor the rapidly evolving geosynchronous orbital environment – providing the nation with enhanced space domain awareness. DARC will augment the military’s space surveillance network as an additional sensor to monitor deep space objects, eventually providing full global coverage.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Electronic Design Automation (EDA) Market Size to Reach $811.1 Million by 2030
11/12/2025 | PRNewswireThe Global Electronic Design Automation (EDA) Market was estimated to be worth USD 541 Million in 2023 and is forecast to a readjusted size of USD 811.1 Million by 2030 with a CAGR of 6.4% during the forecast period 2024-2030.
The Technical Backbone of an EMS Company: A CEO’s Perspective
11/12/2025 | Jay Rupani, Precision PCBAs the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
11/12/2025 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform.
Elementary, Mr. Watson: The Four Horsemen of Copper Confusion
11/12/2025 | John Watson -- Column: Elementary, Mr. WatsonIf there were a PCB Design Dictionary of Confusing Terms, the cover would feature four words that have baffled generations of engineers: polygons, pours, planes, and floods—or what I refer to as the four horsemen of copper confusion. They sound simple, as if they belong in a geometry textbook or a weather report, but in PCB design, they overlap, develop, and sound interchangeable until you realize they aren't.