Entegris Breaks Ground for Manufacturing Center of Excellence in Colorado Springs
June 9, 2023 | EntegrisEstimated reading time: 2 minutes
Entegris, Inc., a leading supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, held a groundbreaking ceremony for its new manufacturing center of excellence in Colorado Springs, Colorado.
At the ceremony, Entegris President and Chief Executive Officer Bertrand Loy noted that the state-of-the-art facility in Colorado Springs will develop products critical to the manufacturing of semiconductors in the United States and around the world. The new leading-edge manufacturing center will serve the semiconductor industry, which is expected to grow to $1 trillion by 2030. Entegris’ commitment to innovation and investment in leading-edge manufacturing and supply chain operations will strongly position Entegris – and its customers – for success, and further bolster Colorado’s and the U.S.’s position as a technology, manufacturing, and innovation leader across the semiconductor ecosystem.
The new campus, which is targeted to begin initial commercial operation in early 2025, will be built in phases. The 100,000-square-foot facility to be built in the initial phase will support production for Entegris’ Microcontamination Control (MC) and Advanced Materials Handling (AMH) divisions. Upon completion, the facility will increase production capabilities for Entegris’ most advanced products for filtration and purification as well as wafer carriers, also known as Front-Opening-Unified Pods (FOUPs). The center of excellence will play an important role in the Colorado Springs community and has the potential to create approximately 600 new jobs over several years. Entegris continues to expect to invest approximately $600 million in phases over several years in the facility and is looking forward to working with the city, county, and state to integrate the site and surrounding land into the community in a way that preserves the natural beauty of Colorado Springs.
“The start of construction of our new world-class facility in Colorado Springs represents an important milestone for Entegris,” Loy said. “The semiconductor manufacturing industry is set to expand in the United States following the passage of the CHIPS and Science Act, and Entegris’ manufacturing center of excellence will enable our organization to play a meaningful role in this important effort. With our large state-of-the-art facility, we will help shorten the supply chain and more efficiently meet the growing needs of domestic manufacturers. We are pleased to have found an innovative and competitive home in Colorado Springs, and we look forward to building on our 30-year history in the region while enhancing our leadership position in the semiconductor ecosystem.”
According to Bill Shaner, president, Advanced Materials Handling, “As we break ground on our new manufacturing center of excellence, we are thrilled to double our presence in Colorado and meaningfully expand our manufacturing footprint in the U.S. We look forward to developing critical products for the future, bringing new jobs to Colorado and supporting U.S. advanced manufacturing. We are grateful to the Colorado Springs community, our dedicated employees and local, state, and federal officials whose sustained government support will help fuel Entegris’ future innovation.”
Among the community leaders attending the groundbreaking were Johnna Reeder Kleymeyer, president & CEO, Colorado Springs Chamber of Commerce and Economic Development Corporation; Chris Jenkins, CEO of Norwood Development Group; Cami Bremer, El Paso County Commissioner; and the city’s recently elected mayor, Yemi Mobolade.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.