Powering the Future: The Materials That Make Tomorrow Possible
Global Sourcing Spotlight: Supplier Audits—Ensuring Compliance in Global Sourcing
Nolan’s Notes: Welcome to a Strong 2026!
GPV’s Site Engagement Meeting for the Eastern, Central European Sites
June 9, 2023 | GPVEstimated reading time: Less than a minute
This week, local management teams from the Eastern and Central European operating business units in GPV met with the Executive Leadership Team (ELT). The meetings took place in Slovakia. On Monday, ELT met with the cable sites from Slovakia and Austria. Tuesday and Wednesday, the electronics sites from Estonia, Slovakia and Switzerland were gathered.
“This week, we had the third cluster of engagement meeting with operating business units, where we meet with the local management teams. Apart from discussing professional subjects like performance and must wins for the coming period, we focus on socialising to build on the personal relations and increase our understanding of our new “One Company”. The purpose of our engagement meetings is to discuss the next four quarters and engage with each other on this. An important outset for such dialogues is to learn and understand what each OBU is especially proud of. We also discussed how to bring down our high inventory level,” says Bo Lybaek, CEO at GPV.
Next week, the Executive Leadership Team will visit GPV Electronics Mexico for the last Site Engagement Meeting before the European summer vacation period.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Advanced Electronic Packaging: How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia
01/19/2026 | Devan Iyer and Matt Kelly, Global Electronics AssociationIn November, more than 200 industry leaders, including government officials, regional domestic companies, multinational companies, and academic experts, gathered at the Olive Tree Hotel in Penang for the Advanced Electronic Packaging (AEP) Workshop, organized by the Global Electronics Association. With 15 expert speakers, three technical tracks, three expert panel discussions, and strong ecosystem participation, the workshop highlighted why advanced electronic packaging is central to the future of Malaysia’s semiconductor industry.
DISTRON First in U.S. to Deploy Keiron LIFT Precision Printing
01/19/2026 | Distron Corp.DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, has today announced a strategic partnership with Keiron Printing Technologies that positions DISTRON as the first company in North America to deploy Keiron’s industrial HF2 LIFT-based precision solder paste printer.
Ynvisible Interactive Enters 2026 with Strong Commercial Momentum
01/19/2026 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a developer of ultra-low-power printed e-paper display technology, today provided an operational update highlighting commercial execution achieved in 2025 and outlining its strategic focus for 2026.
CES 2026 Review: Are We Crossing the Line in Intelligent Systems?
01/19/2026 | Michelle Te, I-Connect007Global Electronics Association senior representatives were impressed by the sheer volume of advanced technology at CES 2026 in Las Vegas last week. “I love the energy and the pace of CES,” said Carrie Sessine, the Association’s chief communications officer, in a LinkedIn post after the event. “There’s so much happening that keeps me moving from one idea to the next.”
Schweizer Electronic Completes Share Sale, Secures Refinancing Through 2033
01/19/2026 | Schweizer Electronic AGThe previously announced sale of 15% of the shares in Schweizer Electronic (Jiangsu) Co., Ltd. (SEC) to WUS Printed Circuit (Kunshan) Co., Ltd. (WUS) was successfully completed in fiscal year 2025 with receipt of the fully agreed purchase price.