-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Yamaha to Launch New YRP10 Solder Paste Printer
June 14, 2023 | Yamaha Motor Co., Ltd.Estimated reading time: 1 minute
Yamaha Motor Robotics, USA, a division of Yamaha Motor Corporation, USA, announces the upcoming August 1, 2023 official launch of the new YRP10 solder paste printer. The YRP10 achieves high-speed, high-precision solder printing, fully automated setup changeovers, and supports independent, dual-lane production.
With this addition to the new “YR” Series of machines, Yamaha has achieved the highest level of printing accuracy in the industry with excellent dynamic rigidity as well as the “3S head”, a programmable angle single squeegee head which controls the attack angle, speed, and printing application force with a single squeegee.
The YRP10 system is also equipped with a stencil vacuum system which prevents stencil shift and ensures full stencil to board gasketing to allow a complete and accurate print across the entire circuit board.
Building off the automation of all setup changeovers found in the YSP10 printer, the automatic support pin setup and stencil replacement option greatly reduces labor and human error when changing out products. Additionally, dual-lane compatibility enables completely independent operation, as each lane can be selected to flexibly support a wide range of diverse products and production formats.
Yamaha continues to innovate with solutions that reduce the amount of operator skill required to run all its products, but especially the printing process, which is generally understood to be the longest changeover process in the line and has the highest possibility of setup errors.
The YRP10 key optional features include the following:
- Automatic support pin placement / replacement function: a maximum of 200 pins can be set to support the substrate, accommodating sizes up to L420 x W420 mm.
- Automatic stencil replacement, whereby the stencil can be automatically replaced after the current printing is finished without actually stopping the printer.
- Automatic, Closed Loop solder paste replenishment, which keeps the solder roll size the same on the board throughout production, ensuring minimal variation of the process throughout the day.
- Automatic Solder Paste transfer, which transfers any remaining solder paste remaining on the stencil to the new stencil, reducing waste, improving print quality and dramatically reducing the time to change over.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.