-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Yamaha to Launch New YRP10 Solder Paste Printer
June 14, 2023 | Yamaha Motor Co., Ltd.Estimated reading time: 1 minute
Yamaha Motor Robotics, USA, a division of Yamaha Motor Corporation, USA, announces the upcoming August 1, 2023 official launch of the new YRP10 solder paste printer. The YRP10 achieves high-speed, high-precision solder printing, fully automated setup changeovers, and supports independent, dual-lane production.
With this addition to the new “YR” Series of machines, Yamaha has achieved the highest level of printing accuracy in the industry with excellent dynamic rigidity as well as the “3S head”, a programmable angle single squeegee head which controls the attack angle, speed, and printing application force with a single squeegee.
The YRP10 system is also equipped with a stencil vacuum system which prevents stencil shift and ensures full stencil to board gasketing to allow a complete and accurate print across the entire circuit board.
Building off the automation of all setup changeovers found in the YSP10 printer, the automatic support pin setup and stencil replacement option greatly reduces labor and human error when changing out products. Additionally, dual-lane compatibility enables completely independent operation, as each lane can be selected to flexibly support a wide range of diverse products and production formats.
Yamaha continues to innovate with solutions that reduce the amount of operator skill required to run all its products, but especially the printing process, which is generally understood to be the longest changeover process in the line and has the highest possibility of setup errors.
The YRP10 key optional features include the following:
- Automatic support pin placement / replacement function: a maximum of 200 pins can be set to support the substrate, accommodating sizes up to L420 x W420 mm.
- Automatic stencil replacement, whereby the stencil can be automatically replaced after the current printing is finished without actually stopping the printer.
- Automatic, Closed Loop solder paste replenishment, which keeps the solder roll size the same on the board throughout production, ensuring minimal variation of the process throughout the day.
- Automatic Solder Paste transfer, which transfers any remaining solder paste remaining on the stencil to the new stencil, reducing waste, improving print quality and dramatically reducing the time to change over.
Suggested Items
ViTrox Showcases Revolutionary SMT Inspection Solutions at SMTA International 2024
10/08/2024 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is pleased to announce our participation in SMTA International (SMTAi) at Donald E. Stephens Convention Center, Booth #2111 and #2730 from 22 to 24 October 2024.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
AIM to Present on Ultra-Miniature Component Assembly at SMT-Info
10/02/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic.
Mycronic’s Jet Set Technology
10/02/2024 | Nolan Johnson, SMT007 MagazineIn this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the software-driven nature of jet printing, which allows for quick program creation and real-time adjustments.
Metcal Introduces New MicroFine Products for Soldering Under the Microscope
10/02/2024 | MetcalMetcal, part of OK International and Dover and a leader in benchtop soldering for electronics and industrial manufacturing, announced the launch of its new MicroFine soldering handpieces and cartridge tips for use under microscopes.