Yamaha to Launch New YRP10 Solder Paste Printer

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Yamaha Motor Robotics, USA, a division of Yamaha Motor Corporation, USA, announces the upcoming August 1, 2023 official launch of the new YRP10 solder paste printer. The YRP10 achieves high-speed, high-precision solder printing, fully automated setup changeovers, and supports independent, dual-lane production.

With this addition to the new “YR” Series of machines, Yamaha has achieved the highest level of printing accuracy in the industry with excellent dynamic rigidity as well as the “3S head”, a programmable angle single squeegee head which controls the attack angle, speed, and printing application force with a single squeegee.

The YRP10 system is also equipped with a stencil vacuum system which prevents stencil shift and ensures full stencil to board gasketing to allow a complete and accurate print across the entire circuit board.

Building off the automation of all setup changeovers found in the YSP10 printer, the automatic support pin setup and stencil replacement option greatly reduces labor and human error when changing out products. Additionally, dual-lane compatibility enables completely independent operation, as each lane can be selected to flexibly support a wide range of diverse products and production formats.

Yamaha continues to innovate with solutions that reduce the amount of operator skill required to run all its products, but especially the printing process, which is generally understood to be the longest changeover process in the line and has the highest possibility of setup errors.

The YRP10 key optional features include the following:

• Automatic support pin placement / replacement function: a maximum of 200 pins can be set to support the substrate, accommodating sizes up to L420 x W420 mm.
• Automatic stencil replacement, whereby the stencil can be automatically replaced after the current printing is finished without actually stopping the printer.
• Automatic, Closed Loop solder paste replenishment, which keeps the solder roll size the same on the board throughout production, ensuring minimal variation of the process throughout the day.
• Automatic Solder Paste transfer, which transfers any remaining solder paste remaining on the stencil to the new stencil, reducing waste, improving print quality and dramatically reducing the time to change over.