Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
ADCO Circuits Prepares for the Next Generation of Operations Advancements in Electronic Assembly
June 16, 2023 | EINPresswire.comEstimated reading time: 2 minutes
ADCO Circuits, a Michigan-based Electronic Manufacturing Service (EMS) provider, has built a reputation as one of the most advanced, well-organized, and cleanest assemblers in the industry. Visitors are routinely impressed with their Rochester Hills plant and how it reflects the company’s unrelenting operational and capital investment strategy — one that creates efficiencies and results in consistent quality for customers while positioning ADCO for the next generation of advancements in PCB assembly.
ADCO’s investments in speed, efficiency, and quality are preparing the company for the technological challenges ahead as designs grow ever more complex. The leadership and engineering teams prioritize good planning, smart design, and detailed documentation, an approach that drives their 2023 capital investment plan. ADCO is announcing four strategic investments that focus on boosting production speed and efficiency. These investments will lead to expediting delivery times, increasing component inventories, and maintaining high levels of quality.
- Automated vertical storage system. Vertical storage solutions improve the speed and flow of parts to assembly lines, saving significant time. Due to an increase in business, ADCO installed a seventh vertical storage system that adds capacity for an additional 27k 8mm reels. The ergonomic Hänel Lean-Lift® storage system retrieves items in seconds and protects sensitive electronic components.
- Automated IMS bar coding system at receiving. ADCO’s new Scienscope Reel Smart™ Incoming Material Station further automates the receiving process by capturing multiple reel’s barcode information simultaneously. The IMS improves accuracy and component receiving velocity.
- New robotic thermal adhesive dispenser. A new dispenser system for a major new customer project allows the ADCO team to program the precise dispensing of complex patterns of thermal adhesive material. Along with ADCO’s four other robotic dispensing systems, the new dispenser helps to improve product quality and consistency while reducing manufacturing costs.
- ADCOproto expedites prototyping. ADCO has been a leader in prototype assemblies for more than 30 years. The company recently unveiled ADCOproto.com version 2.0, their online tool that provides engineers with instant component availability for uploaded BOMs. It also suggests alternates if there is a supply issue or allows the engineer to specify an alternate — all in real time!
A friendly reminder to order your parts. Despite ADCO’s investments, electronic assemblers in the US, are still challenged with supply chain issues. ADCO reminds customers to preorder as many parts as possible, even before designs are finalized. Since components are typically a modest percentage of the total BOM costs, the risks are low compared to longer lead times.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025
11/17/2025 | Sydney Xiao, Global Electronics Association East AsiaDiscussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.
Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems
11/18/2025 | Jesse Vaughan -- Column: Beyond the BoardOver the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.
SPEA Honored with Bosch Global Supplier Award
11/14/2025 | SPEABosch, a leading global supplier of technology and services, has honored SPEA with a prestigious Bosch Global Supplier Award, recognizing the company’s excellence as a provider of manufacturing test equipment and systems for microelectronics
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Sypris Reports Third Quarter Results
11/12/2025 | BUSINESS WIREThe Company’s third quarter revenue decreased compared to the prior-year quarter primarily due to the near-term impact of tariffs, which reduced demand from certain transportation-related customers and necessitated the conversion of certain shipments from our facility in Mexico to a value-add only sub-maquiladora.