Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Becoming Grant-ready in the Private Sector

11/11/2025 | Nyron Rouse, Global Electronics Association
Companies in the electronics industry are expected to innovate faster, modernize operations, deliver resilient supply chains, and compete on a global stage. It’s a high bar to meet for manufacturers facing tightening margins, talent shortages, and evolving economic and policy conditions, but opportunities remain for those prepared to take action.

Mycronic Secures Turnkey Solution Order from a Nordic Defense Actor

11/05/2025 | Mycronic
Mycronic has received a full-line, ready-to-use solution order from a major defense industry supplier based in the Nordic region. The order encompasses a complete solution for advanced circuit board manufacturing, including high-tech production equipment and integrated software systems.

SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development

11/04/2025 | SEMI
The SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.

Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products

11/03/2025 | Technica USA
Technica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/31/2025 | Nolan Johnson, I-Connect007
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in