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Kurtz Ersa Introduces Auto Scavenger Module for Leading HR 600 XL Rework System
June 21, 2023 | Kurtz Ersa Inc.Estimated reading time: 1 minute
Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to unveil the new Auto Scavenger Module, a valuable extension for the Ersa HR 600 XL rework platform. Designed to enhance the efficiency and effectiveness of non-contact removal of residual solder from circuit boards, this module represents a significant advancement in rework technology. The Ersa HR 600 XL is the technologically leading rework platform for large electronic assemblies.
With just three simple clicks, users can define the specific area on the assembly where residual solder needs to be removed after desoldering a component. The Auto Scavenger module then automatically identifies the required tracks and initiates the cleaning process promptly, while ensuring the board remains preheated.
Featuring cleaning speeds ranging from 1 mm/s to 3 mm/s, the Auto Scavenger module ensures efficient and thorough removal of residual solder from large electronic assemblies. Moreover, users have the flexibility to fine-tune the cleaning performance by adjusting parameters such as nitrogen temperature and track speed. Individual profiles can be saved for each assembly, enabling a customized and optimized cleaning process.
The innovative module operates with a constant base temperature for the entire assembly. The solder to be removed is heated on the board surface using an N2-fed hot gas nozzle and then extracted via a vacuum nozzle. Importantly, the automatic height control feature ensures that the assembly remains untouched physically throughout the process. Additionally, users can mark "keep out areas" directly in the live image, designating specific regions where suction is not required. Once the solder removal is complete, the assembly is efficiently cooled down and ready for the seamless reinstallation of a component.
"The introduction of the Auto Scavenger Module represents another step forward in rework technology," said Todd DeZwarte, Director of Sales – North America, Rework & Inspection at Ersa. "We are excited to offer our customers a solution that not only enhances the cleaning performance of the HR 600 XL rework system but also provides the flexibility and precision required for diverse assembly requirements. This module enables efficient and reliable removal of residual solder, contributing to improved productivity and high-quality results."
The Auto Scavenger Module is now available as an optional feature for the Ersa HR 600 XL rework system, empowering manufacturers to optimize their rework processes.
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.