Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Emerald EMS Enhances Efficiency, Performance with IDENTCO Label Feeder
July 11, 2023 | Emerald EMSEstimated reading time: 2 minutes
Emerald EMS, a renowned leader in electronics assembly, has taken a significant stride towards optimizing manufacturing operations at its Saline, MI location by acquiring the state-of-the-art IDENTCO ILP-45 Label Feeder through The Murray Percival Company. This strategic investment highlights Emerald’s commitment to exceeding customer expectations through cutting-edge technology and process enhancements.
The IDENTCO ILP-45 Label Feeder brings a range of benefits to their production line, including a remarkable reduction in operator manual labor, improved placement accuracy, accelerated labeling processes, and an overall increase in the output of finished PCBs. By integrating this advanced label feeder into its operations, Emerald EMS is poised to achieve new levels of efficiency and productivity.
As a customer-centric organization, Emerald EMS consistently strives to solve the most complex technical challenges while maintaining an unwavering commitment to flexibility. The company has built a reputation for assembling a passionate, talented, and technically-oriented team, resulting in successful partnerships with an array of remarkable clients.
The addition of the IDENTCO ILP-45 Label Feeder allows users to further optimize their investment in automation technologies. By automating the label placement process, the label feeder significantly reduces labor costs while ensuring maximum accuracy and efficiency. The seamless integration of the label feeder onto the existing pick-and-place equipment minimizes the need for additional floor space, making it a practical and space-efficient solution.
"The acquisition of the IDENTCO ILP-45 Label Feeder represents our unwavering dedication to providing superior manufacturing solutions to our clients," stated Randy Ferrell, Process Engineering Manager at Emerald EMS, Saline, MI. "By streamlining our labeling process, we anticipate a significant boost in productivity and operational excellence, ultimately delivering enhanced value to our customers. We appreciate our rep, The Murray Percival Company, for recognizing a need for this in our facility and bringing us a solution.”
IDENTCO, renowned for its industry expertise, has skillfully engineered the label feeder to exceed labeling requirements. When combined with the appropriate auto-apply labels, the IDENTCO ILP-45 Label Feeder ensures optimal performance, contributing to manufacturers' pursuit of operational perfection and data delivery control.
With features like maximum label placement accuracy, flexible solutions for circuit board applications, and low maintenance costs, the IDENTCO ILP-45 Label Feeder aligns seamlessly with Emerald EMS’ mission to offer trusted solutions for high-reliability and mission-critical products.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
TLT Electronics Officially Opens Facility in Vietnam
05/06/2026 | TLT ElectronicsLithuanian EMS provider TLT Electronics has recently announced the opening of a new facility in Vietnam. For their clients, this is a chance to expand manufacturing into a second region without the headache of onboarding a new supplier. Same team, same processes, same quality standards — still TLT Manufacturing, just on another continent.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
The Missing Connection: Wire Harness Quoting Joins the Digital Age
05/01/2026 | Joanne Harris, Tech-2marketingWalk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?