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SHENMAO Offers Halogen-Free SM-862 Liquid Flux as a Replacement for SM-816
July 13, 2023 | SHENMAO America, Inc.Estimated reading time: 1 minute
SHENMAO America, Inc. is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816. The SM-862 Flux offers a range of benefits, including low solid content and smooth residue, making it an excellent choice for automatic wave soldering and manual dipping processes.
SM-862 is a rosin-containing flux specifically formulated to leave minimal residue and reduce the occurrence of bridges during soldering. This halogen-free ROL0 (J-STD-004B) flux is tack-free and no-clean, suitable for various automated and selective soldering applications. It exhibits exceptional hole-fill ability and effectively prevents bridges when soldering high-density components on circuit boards.
The versatility of SM-862 makes it ideal for applications such as wave soldering, selective soldering and dipping. It is well-suited for use in industrial PC (IPC), motherboards, power boards, server boards, and other components requiring dipping. The flux delivers excellent solderability and leaves behind a flux residue that exhibits high voltage endurance.
SHENMAO has received approval from numerous internationally renowned electronic manufacturers, affirming the quality and reliability of their products. The company's commitment to delivering the highest standards without compromising on cost and time-to-market ensures maximum value for its customers. SHENMAO America, Inc. manufactures SMT solder paste at its San Jose, CA facility for distribution throughout North America.
"We are excited to introduce the halogen-free SM-862 Liquid Flux as an alternative to the widely used SM-816," said Watson Tseng, General Manager at SHENMAO America, Inc. "With its low solid content, smooth residue, and excellent solderability, SM-862 provides our customers with a reliable solution for their soldering needs. We are dedicated to offering top-quality products that meet the highest industry standards."
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.