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Trackwise Provides Updates on OEM Supplier Nomination, Sale of SCL
July 21, 2023 | TrackwiseEstimated reading time: 1 minute
Trackwise Designs plc, a leading manufacturer of specialist products using printed circuit technology, announces an update on progress towards supplier nomination for a prospective OEM end customer.
Nomination Update
After working with a Tier-1 for more than a year on the opportunity to supply Cell Connection System FPCAs to the Tier-1, for onward assembly and supply to OEM B, Trackwise has been informed by the Tier-1 that the Tier-1 has not been successful in obtaining nomination from OEM B.
As a result the Board is reviewing all options for TWD, and a further announcement will be made shortly.
Delay of Results
In accordance with Rule 19 of the AIM Rules for Companies, the Company was required to publish its 2022 Annual Report by 30 June 2023. The Company previously announced that it expected to publish the 2022 Annual Report during July 2023. As a result of the above news regarding nomination for OEM B, publication of the 2022 Annual Report will be further delayed. Accordingly, trading in the Company's ordinary shares on AIM will remain suspended at this time.
The SCL Sale Process
Further to the announcement on 3rd May, a sales agent for the SCL Sale Process has been appointed and the process is underway. Initial offers have been received and are being assessed.
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SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
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2024 Stromberg Student Leader Scholarship Recipient Announced
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Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.