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Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
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The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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ITW EAE Wins Best Paper of TC1 Technology Conference Presented at Nepcon China 2023
July 24, 2023 | ITW EAEEstimated reading time: Less than a minute
ITW EAE was selected as the winner of the best paper of TC1 Technology Conference by SMTA China East. The paper, “Selective Soldering with High-Performance Lead-Free Solders” was presented at Nepcon China 2023 by Khoh Kar Heong, ITW EAE Sales Engineering Manager.
The paper investigates three commercially available high-performance lead-free solders designed for circuit assemblies that are located under the hood of automobiles or other harsh environments. These solders were compared to the standard lead-free alloy, Sn3.0Ag0.5Cu, for four different through-hole assemblies.
The paper concludes that the major parameters in selective soldering that contribute to good hole filling are all related to wetting. Once the solder temperature and drag speed are optimized, all other factors: flux type, nozzle type, and solder alloy are less critical for hole filling. Solder composition is an issue in selective soldering. This experiment concluded that the Ni and Cu content can be a critical factor for formation of (Cu, Ni)6Sn5 and or Cu6Sn5 needles.
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