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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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KLA Names Michael R. McMullen to Board of Directors
July 25, 2023 | KLAEstimated reading time: Less than a minute
KLA Corporation announced the appointment of Michael R. McMullen to its Board of Directors and Compensation and Talent Committee.
McMullen was named President of Agilent Technologies in 2014 and Chief Executive Officer in 2015 and has been with the company and its predecessor, Hewlett-Packard, for more than 30 years.
"We are excited to welcome Mike McMullen to the KLA board," commented Robert M. Calderoni, chair of the board of KLA. "Mike's extensive experience in driving growth at a global scale in complex multinational equipment businesses makes him an ideal fit for KLA's board as we execute our long-term growth strategies."
Suggested Items
PCB007 Magazine: November 2024—Engineering Economics
11/18/2024 | I-Connect007 Editorial TeamThe real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Schweizer Electronic Lowers 2024 Financial Forecast Amid Challenging Market Conditions
11/06/2024 | Schweizer Electronic AGBased on the preliminary financial results for the first nine months of 2024 of the SCHWEIZER Group, the Executive Board has adjusted the forecast for the 2024 financial year.
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
Real Time with... SMTAI 2024: SMTA Austin on the Grow
11/04/2024 | Real Time with...SMTAIIn this interview from SMTAI 2024, Nolan Johnson chats with SMTA Austin Chapter Treasurer Brad Pagano, who shares what he's learned in his first 10 months of board service with this growing chapter. His insights are good advice for board members in other chapters.
CEE PCB to Exhibit at Electronica 2024
10/31/2024 | CEE PCBTom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.