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KLA Names Michael R. McMullen to Board of Directors
July 25, 2023 | KLAEstimated reading time: Less than a minute
KLA Corporation announced the appointment of Michael R. McMullen to its Board of Directors and Compensation and Talent Committee.
McMullen was named President of Agilent Technologies in 2014 and Chief Executive Officer in 2015 and has been with the company and its predecessor, Hewlett-Packard, for more than 30 years.
"We are excited to welcome Mike McMullen to the KLA board," commented Robert M. Calderoni, chair of the board of KLA. "Mike's extensive experience in driving growth at a global scale in complex multinational equipment businesses makes him an ideal fit for KLA's board as we execute our long-term growth strategies."
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Sweeney Ng - CEE PCBSuggested Items
NCAB Reports Continued Growth in Order Intake and Net Sales in Q3 2025
10/24/2025 | NCAB GroupNCAB Group AB announced its interim report for January–September 2025, showing continued positive momentum with Q3 net sales up 6% to SEK 949 million and order intake rising 11%, driven by strong performance in key markets despite a challenging global economy.
Amphenol Reports Record Q3 2025 Results and Announces Dividend Increase
10/24/2025 | Amphenol CorporationThe Company continues to deploy its financial strength in a variety of ways to increase shareholder value. During the third quarter, the Company purchased 1.4 million shares of its common stock for $153 million and paid dividends of $201 million, resulting in total capital returned to shareholders of approximately $354 million.
MKS’ Atotech Showcases Next-gen PCB and Substrate Manufacturing Solutions at CPCA Plus 2025
10/24/2025 | MKS Inc.MKS Inc., a global provider of enabling technologies that transform our world, announced its participation in CPCA Plus Show 2025, taking place October 28 – 30 at Shenzhen International Convention and Exhibition Center.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
Peters Spotlights Heatsink Paste at productronica
10/22/2025 | PetersThe ELPEPCB HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.