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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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KLA Names Michael R. McMullen to Board of Directors
July 25, 2023 | KLAEstimated reading time: Less than a minute
KLA Corporation announced the appointment of Michael R. McMullen to its Board of Directors and Compensation and Talent Committee.
McMullen was named President of Agilent Technologies in 2014 and Chief Executive Officer in 2015 and has been with the company and its predecessor, Hewlett-Packard, for more than 30 years.
"We are excited to welcome Mike McMullen to the KLA board," commented Robert M. Calderoni, chair of the board of KLA. "Mike's extensive experience in driving growth at a global scale in complex multinational equipment businesses makes him an ideal fit for KLA's board as we execute our long-term growth strategies."
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Simon Khesin - Schmoll MaschinenSuggested Items
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
NCAB Group Reports Strong Q1 2026 Results Driven by AI-Led Market Growth
04/23/2026 | NCAB GroupNCAB Group AB has released its Interim Report for the first quarter of 2026, reporting double-digit growth in net sales, a significant surge in order intake, and improved profitability amid a dynamic global PCB market environment.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.
Introducing FKN Systek Depanelizer with Linear Guide Table for Small PCBs
04/20/2026 | FKN SystekSingulating small PCBs with circular blade depanelizers can be a tedious repetitive process which can easily result in board damage due to operator fatigue. Increase process quality and safety by using the FKN Systek K2010 motorized circular blade depanelizer with a support table to separate the V-Scored boards.
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
04/17/2026 | Real Time with... APEX EXPOAt APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.