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Quanta Partners with Obsidian Sensors to Spearhead Thermal Imaging Solutions

05/22/2024 | PRNewswire
Quanta Computer Inc., a trailblazer in advanced technology solutions for computing, consumer electronics and smart automotive solutions, is partnering with Obsidian Sensors, Inc., a San Diego, California company, to produce high resolution thermal imaging cameras for automobiles.

Molex Releases Report on Thermal Management Challenges and Opportunities for I/O Modules

05/22/2024 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has published a report that examines thermal management pitfalls and possibilities as data center architects and operators strive to balance high-speed data throughput requirements with the impacts of growing power density and the need for heat dissipation on critical servers and interconnect systems.

Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC

05/16/2024 | Indium Corporation
Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.

Peters: Casting Compound Perfectly Protects Electronics from Overheating

05/15/2024 | Peters
With ELPECAST® VU 4545/101, Peters has recently added a casting compound to its product portfolio that is characterised by particularly high thermal conductivity.

Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products

05/01/2024 | Real Time with...IPC APEX EXPO
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
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