Learning With Leo: What Is the Cost of Quality Brought About by Training?
Nolan’s Notes: A Tribute to Iola—and Automation
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
May 16, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado. The presentation, part of the Advanced Die Bond and Board Level Reliability session, will examine the findings from technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.
To address the impending need for replacement of high-lead (Hi-Pb) solders in die-attach and clip-bond usage for power discrete semiconductor applications, tin-antimony (SnSb)-based solder pastes have been developed with Indium Corporation’s patented Durafuse® technology, which combines the merits of the two constituent powders. The study found that the mechanical strength of the reflowed joints around temperatures of 260°C or higher, inherited from the Sb-bearing powder, was still comparable to or stronger than high-lead solders.
“Although the current technology supporting lead-free materials is not yet sufficient to replace commonly used high-Pb options for this application, the results of this study may signal a potential way forward,” said Aserian. “I look forward to sharing these promising findings, as well as the challenges still present with my colleagues at ECTC.”
Since joining Indium Corporation in 2022, Aserian has been at the forefront of designing and executing experiments to test the efficacy of new and existing alloys. His work involves creating processing windows tailored to customers’ needs, ensuring stringent quality inspection, devising innovative test methods, and reliability testing for developed soldering materials.
Indium Corporation Senior Research Chemist Dr. Guangyu Fan and Research Associate Jacob Wells will also present a poster at the conference, Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices.
This poster examines recent efforts to develop liquid metal TIMs containing organic compounds (LMO) that enhance the deposit process and thermal performance for improved thermal management in electronic devices. The thermal conductivity, resistance, and reliability of LMOs and LMAs were measured using TIMA 5 (ASTM-D5470) and evaluated by a house-made power cycler, respectively.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Coherent Expands Silicon Carbide Platform with 300mm Capability to Support Growing Demand of AI and Datacenters
12/04/2025 | Globe NewswireCoherent Corp., a global leader in photonics, announced a major milestone in its next-generation 300mm silicon carbide (SiC) platform to address increasing thermal efficiency demands in AI datacenter infrastructure.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.
Rubin’s Cableless Architecture and ASIC High-Layer HDI Designs Push PCBs to the Center of AI Compute Power
11/20/2025 | TrendForceTrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance.
Beyond Design: Micro-ohm Power Delivery Network for AI-driven GPUs
11/18/2025 | Barry Olney -- Column: Beyond DesignThe evolution of modern processors, marked by faster edge transitions, reduced output impedance, and increasingly complex bus architectures, has significantly augmented the demands on PCB infrastructure. These challenges are compounded by AI-driven graphics processing units (GPUs), which require exceptionally high-power delivery at ultra-low operating voltages, placing greater stress on power integrity and layout design.