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Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
May 16, 2024 | Indium CorporationEstimated reading time: 1 minute

Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado. The presentation, part of the Advanced Die Bond and Board Level Reliability session, will examine the findings from technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.
To address the impending need for replacement of high-lead (Hi-Pb) solders in die-attach and clip-bond usage for power discrete semiconductor applications, tin-antimony (SnSb)-based solder pastes have been developed with Indium Corporation’s patented Durafuse® technology, which combines the merits of the two constituent powders. The study found that the mechanical strength of the reflowed joints around temperatures of 260°C or higher, inherited from the Sb-bearing powder, was still comparable to or stronger than high-lead solders.
“Although the current technology supporting lead-free materials is not yet sufficient to replace commonly used high-Pb options for this application, the results of this study may signal a potential way forward,” said Aserian. “I look forward to sharing these promising findings, as well as the challenges still present with my colleagues at ECTC.”
Since joining Indium Corporation in 2022, Aserian has been at the forefront of designing and executing experiments to test the efficacy of new and existing alloys. His work involves creating processing windows tailored to customers’ needs, ensuring stringent quality inspection, devising innovative test methods, and reliability testing for developed soldering materials.
Indium Corporation Senior Research Chemist Dr. Guangyu Fan and Research Associate Jacob Wells will also present a poster at the conference, Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices.
This poster examines recent efforts to develop liquid metal TIMs containing organic compounds (LMO) that enhance the deposit process and thermal performance for improved thermal management in electronic devices. The thermal conductivity, resistance, and reliability of LMOs and LMAs were measured using TIMA 5 (ASTM-D5470) and evaluated by a house-made power cycler, respectively.
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08/18/2025 | IDTechExIDTechEx forecasts that the market size of thermal interface materials (TIMs) will exceed US$7 billion, covering multiple industries including EV batteries, EV power electronics (TIM1 and TIM2), data centers, advanced semiconductor packaging (TIM1 and TIM1.5), ADAS sensors, consumer electronics, and 5G.
BTU International to Feature Aurora Reflow Technology at SMTA Michigan and Ohio Expos
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Kopin Announces $9 Million Follow-On Contract for Defense Thermal Imaging Assembly
08/14/2025 | BUSINESS WIREKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, industrial, consumer and medical products, today announced the award of an approximate $9 million follow-on production contract in support of a custom thermal imaging assembly build for a major U.S. defense prime contractor.
Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.