Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
KYZEN Places Focus on Two Chemistries at SMTA Michigan & Ohio Valley Expos
August 2, 2023 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, August 15, 2023, at Laurel Manor in Livonia, MI, and the SMTA Ohio Valley Expo & Tech Forum on Thursday, August 17, 2023, at the Embassy Suites by Hilton Cleveland-Rockside in Independence, OH.
At both events, the KYZEN clean team will highlight two products, each specializing in a different phase of the cleaning process: AQUANOX A4626 AND KYZEN E5631J. Though they are used at different phases of PCB assembly, both chemistries are formulated with a priority on cleaning efficiency and effectiveness.
AQUANOX A4626 is an environmentally friendly aqueous cleaning agent designed to quickly remove the latest polymeric no-clean flux residues with a wide compatibility window on boards, components, labels and metallic surfaces. A4626 is easy to use and control in addition to possessing long tank life and superior effectiveness for jettable paste applications.
KYZEN E5631J is a ready-to-use understencil wipe solution for removing raw solder paste in online and offline stencil cleaning processes. Formulated with both the worker and environment in mind, E5631J quickly and efficiently cleans all types of raw solder pastes and is proven compatible with common stencils, cleaning equipment and printer manufacturers.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.