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ViTrox to Demonstrate Next-Generation Vision Inspection Systems at ELEXCON Shenzhen 2023
August 3, 2023 | ViTroxEstimated reading time: 1 minute
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce its first-ever participation in ELEXCON Shenzhen 2023, one of the influential trade shows in Southern China, at Hall 9, Booth #9G17 in Shenzhen Convention & Exhibition Center (SZCEC), China from 23-25 August 2023.
ViTrox will be showcasing its latest Back-end Semiconductor Inspection Solutions, which are the Tray-Based Vision Handler – TR3000i and the Post Seal Vision Handler – VR20i G2 during the event.
Introducing the Tray-to-Tape & Reel Vision Inspection Handler –TR3000i, the cutting-edge solution tailored for 5G, IoT, Automotive, and Industry 4.0 industries. Its high-resolution 6-sided vision system ensures comprehensive inspections, supporting sizes from 1.8x1.8mm to 130x130mm without conversion. The TR3000i's robust handling features auto-pitching, tape width conversion, 8 active approaches for Smart Taper Precision, and up to 3x14 pick-and-place nozzles. With additional hardware configurations like the Smart Reel Changer, Auto Nozzle Changer, AUX Tray, and Extended Track, it guarantees high efficiency and high throughput. Fully automated and A.I.-powered, it optimises production yield, setting new standards for efficiency, connectivity, and precision in emerging industries.
ViTrox’s Post Seal Vision Handler – VR20i G2 is a game-changer in reel-to-reel inspection. Designed for tape widths from 8mm to 32mm, it features advanced visual inspection capabilities and automated mechanisms for track and dummy reel width adjustment, ensuring precise component handling. The system supports various package types with multiple vision inspections, enabling comprehensive and high-quality results. With dual-track to improve productivity, it enhances throughput by processing over 130K UPH for a 2mm pocket pitch and 80K UPH for a 4mm pocket pitch, while fast changeovers for different carrier tapes minimise downtime. The VR20i G2 guarantees maximum efficiency, reduces human error, and greatly reduces the return on investment (ROI) period, making it the ideal solution to automate your final gate inspection.
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Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.